Features Standard 4532 mm (1812 mils) footprint 100 % electrically compatible with all previous generations of 1812 SMT devices Compatible with Pb and Pb-free solder re ow pro les RoHS compliant* and halogen free** Surface mount packaging for automated assembly Agency recognition: MF-MSMF L Series - PTC Resettable Fuses Electrical Characteristics Tripped Max. Time I I Resistance Power hold trip To Trip Dissipation V max. I max. Model Amperes Ohms Amperes Seconds Watts Volts Amps at 23 C at 23 C at 23 C at 23 C at 23 C Hold Trip R R Typ. Min. 1Max. MF-MSMF110L 6.0 100 1.10 2.20 0.04 0.21 8.0 0.30 0.8 MF-MSMF150L 6.0 100 1.50 3.00 0.03 0.120 8.0 0.5 0.8 MF-MSMF160L 8.0 100 1.60 2.80 0.035 0.099 8.0 2.0 0.8 MF-MSMF200L 8.0 40 2.00 4.00 0.020 0.080 8.0 3.0 0.8 MF-MSMF260L 6.0 100 2.60 5.20 0.0150.080 8.0 5.0 0.8 Environmental Characteristics Operating Temperature ......................................... -40 C to +85 C Maximum Device Surface Temperature in Tripped State .................................................... 125 C Passive Aging ....................................................... +85 C, 1000 hours ............................................... 5 % typical resistance change Humidity Aging ..................................................... +85 C, 85 % R.H. 1000 hours ............................. 5 % typical resistance change Thermal Shock ..................................................... +85 C to -40 C, 20 times ................................... 10 % typical resistance change Solvent Resistance ............................................... MIL-STD-202, Method 215 ................................... No change Vibration ............................................................... MIL-STD-883C, Method 2007.1, .......................... No change Condition A Test Procedures And Requirements For Model MF-MSMF L Series Test Test Conditions Accept/Reject Criteria Visual/Mech. ......................................................... Verify dimensions and materials ........................... Per MF physical description Resistance ............................................................ In still air 23 C .................................................. Rmin R R1max Time to Trip ........................................................... At speci ed current, Vmax, 23 C ........................ T max. time to trip (seconds) Hold Current ......................................................... 30 min. at Ihold ..................................................... No trip Trip Cycle Life ....................................................... Vmax, Imax, 100 cycles ........................................ No arcing or burning Trip Endurance ..................................................... Vmax, 48 hours ..................................................... No arcing or burning Solderability .......................................................... ANSI/J-STD-002 ................................................... 95 % min. coverage UL File Number .................................................... E174545 Applications Overcurrent and overtemperature Point-of-sale (POS) equipment protection of automotive electronics PCMCIA cards Hard disk drives USB port protection - USB 2.0, 3.0 & OTG PC motherboards HDMI 1.4 Source protection PC peripherals MF-MSMF L Series - PTC Resettable Fuses Product Dimensions AB C D Model Min. Max. Min. Max. Min. Max. Min. 4.37 4.73 3.07 3.41 0.45 0.85 0.30 MF-MSMF110L (0.172) (0.186) (0.121) (0.134) (0.018) (0.033) (0.012) 4.37 4.73 3.07 3.41 0.55 0.85 0.30 MF-MSMF150L (0.172) (0.186) (0.121) (0.134) (0.015) (0.033) (0.012) 4.37 4.73 3.07 3.41 0.55 0.85 0.30 MF-MSMF160L (0.172) (0.186) (0.121) (0.134) (0.015) (0.033) (0.012) 4.37 4.73 3.07 3.41 0.45 0.85 0.30 MF-MSMF200L (0.172) (0.186) (0.121) (0.134) (0.018) (0.033) (0.012) 4.37 4.73 3.07 3.41 0.48 0.85 0.30 MF-MSMF260L (0.172) (0.186) (0.121) (0.134) (0.019) (0.033) (0.012) MM Packaging: 2000 pcs. per reel. DIMENSIONS: (INCHES) Top View Bottom View Side View Recommended Pad Layout Terminal material: A C 1.5 0.05 1.5 0.05 Electroless Ni under immersion Au (.059 .002) (.059 .002) Termination pad solderability: Standard Au nish: 3.2 0.1 B (0.126 .004) Meets ANSI/J-STD-002 Category 2. 2.7 0.1 Recommended Storage: (.106 .004) 40 C max./70 % RH max. D Typical Time to Trip at 23 C 100 MF-MSMF200L The Time to Trip curves represent typical performance of a device in a simulated application environment. Actual performance 10 in speci c customer applications may differ from these values due to the in uence of other variables. 1 MF-MSMF260L 0.1 MF-MSMF160L MF-MSMF150L 0.01 MF-MSMF110L 0.001 0.1 1 10 100 Fault Current (Amps) Speci cations are subject to change without notice. Customers should verify actual device performance in their speci c applications. 110 Time to Trip (Seconds)