Features Applications n Surface mount devices Used as a secondary overcurrent protection device in: n High voltage surge capabilities n Customer Premise Equipment (CPE) n Binned and sorted resistance ranges n Central Office (CO) n Assists in meeting ITU K.20/K.21 specifications n Subscriber Line Interface Cards (SLIC) n RoHS compliant* n Agency recognition: MF-SM/250 - Telecom PTC Resettable Fuses Electrical Characteristics Max. One Hour Tripped Max. Interrupt Hold Initial Operating Post-Trip Power Ratings Current Resistance Voltage Resistance Dissipation Model Volts Volts Amps Amps Ohms Ohms Ohms Watts (V) (V) (A) at 23 C at 23 C at 23 C at 23 C at 23 C Max. Max. I Min. Max. Max. Typ. H MF-SM008/250F-2 80 250 3.0 0.08 5.0 11.0 20.0 1.5 MF-SM013/250-2 60 250 3.0 0.13 6.5 12.0 20.0 3.3 MF-SM013/250-A-2 60 250 3.0 0.13 6.5 9.0 20.0 3.3 MF-SM013/250-B-2 60 250 3.0 0.13 9.0 12.0 20.0 3.3 MF-SM013/250-C-2 60 250 3.0 0.13 7.0 10.0 20.0 3.3 Environmental Characteristics Operating Temperature ......................................... -40 C to +85 C Maximum Device Surface Temperature in Tripped State ................................................ 125 C Passive Aging ....................................................... +85 C, 1000 hours ............................................... 15 % typical resistance change Humidity Aging...................................................... +85 C, 85 % R.H. 1000 hours ............................. 15 % typical resistance change Thermal Shock ..................................................... MIL-STD-202F, Method 107G, .............................. 15 % typical resistance change .......................................................................... +125 C to -55 C,10 times ................................... 15 % typical resistance change Solvent Resistance ............................................... MIL-STD-202, Method 215B ................................. No change Lead Solerability ................................................... ANSI/J-STD-002 Vibration ............................................................... MIL-STD-883C, Method 2007.1, Condition A ....... No change Moisture Sensitivity Level (MSL) ...........................Level 1 ESD Classification - HBM ......................................Class 6 Test Procedures And Requirements For Model MF-SM/250 Series Test Test Conditions Accept/Reject Criteria Visual/Mech................................................... Verify dimensions and materials .......................Per MF physical description Resistance ....................................................... In still air 23 C .............................................Rmin R Rmax Time to Trip ...................................................... At specified current, Vmax, 23 C .....................T max. time to trip (seconds) Hold Current .................................................... 30 min. at Ihold .................................................No trip Trip Cycle Life .................................................. Vmax, Imax, 100 cycles ....................................No arcing or burning Trip Endurance ................................................ Vmax, 48 hours .................................................No arcing or burning Solderability ..................................................... MIL-STD-202F, Method 208F ...........................95 % min. coverage UL File Number ............................................... E174545 TV File Number MF-SM008/250-2 ......................................... R50118917 MF-SM013/250-2 ......................................... R2057213 Thermal Derating Chart - I I (Amps) hold/ trip Ambient Operating Temperature Model -40 C -20 C 0 C 23 C 40 C 50 C 60 C 70 C 85 C MF-SM008/250-2 0.124 / 0.34 0.110 / 0.30 0.095 / 0.26 0.080 / 0.22 0.066 / 0.18 0.059 / 0.16 0.051 / 0.14 0.044 / 0.12 0.033 / 0.09 MF-SM013/250-2 0.21 / 0.42 0.18 / 0.37 0.16 / 0.31 0.13 / 0.26 0.10 / 0.23 0.09 / 0.18 0.08 / 0.15 0.07 / 0.12 0.05 / 0.10 MF-SM013/250-A-2 0.21 / 0.42 0.18 / 0.37 0.16 / 0.31 0.13 / 0.26 0.10 / 0.23 0.09 / 0.18 0.08 / 0.15 0.07 / 0.12 0.05 / 0.10 MF-SM013/250-B-2 0.21 / 0.42 0.18 / 0.37 0.16 / 0.31 0.13 / 0.26 0.10 / 0.23 0.09 / 0.18 0.08 / 0.15 0.07 / 0.12 0.05 / 0.10 MF-SM013/250-C-2 0.21 / 0.42 0.18 / 0.37 0.16 / 0.31 0.13 / 0.26 0.10 / 0.23 0.09 / 0.18 0.08 / 0.15 0.07 / 0.12 0.05 / 0.10 *RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011. Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf. *RoHS COMPLIANT VERSIONS AVAILABLE *RoHS COMPLIANT LEAD FREE LEAD FREE VERSIONS ARE RoHS COMPLIANT*Additional Features n Withstands lightning power induction MF-SM/250 - Telecom PTC Resettable Fuses Product Dimensions A B C D E G H I Model Max. Max. Max. Nom. Nom. Nom. Nom. Nom. 7.9 3.7 5.3 0.3 3.8 9.7 3.1 2.3 MF-SM008/250-2 (0.311) (0.146) (0.209) (0.012) (0.149) (0.383) (0.122) (0.091) Recommended Pad LayoutRecommended Pad Layout 9.4 3.7 7.4 0.3 3.8 9.7 4.6 1.8 MF-SM013/250-2 (0.370) (0.146) (0.291) (0.012) (0.149) (0.383) (0.18) (0.071) I I I I 9.4 3.7 7.4 0.3 3.8 9.7 4.6 1.8 MF-SM013/250-A-2 (0.370) (0.146) (0.291) (0.012) (0.149) (0.383) (0.18) (0.071) C C 9.4 3.7 7.4 0.3 3.8 9.7 4.6 1.8 MF-SM013/250-B-2 (0.370) (0.146) (0.291) (0.012) (0.149) (0.383) (0.18) (0.071) 9.4 3.7 7.4 0.3 3.8 9.7 4.6 1.8 H H H H MF-SM013/250-C-2 (0.370) (0.146) (0.291) (0.012) (0.149) (0.383) (0.18) (0.071) G G Recommended Pad Layout Packaging: A A MM TAPE & REEL: 1500 pcs. per reel DIMENSIONS: Recommended Pad Layout I I (INCHES) I I C B B Terminal material: C Tin-plated brass H H E E D D H H G End ViewEnd View Side ViewSide View A G A Solder Reflow Recommendations B Preheating Soldering Cooling B 300 Solder reflow E D Recommended reflow methods: IR, vapor phase oven, hot air oven. 250 E Devices are not designed to be wave soldered to the bottom side of the End View Side View D 200 board. End View Side View Gluing the devices is not recommended. 150 Recommended maximum paste thickness is 0.25 mm (.010 inch). Devices can be cleaned using standard industry methods and solvents. 100 Note: 50 If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements. 0 Rework 160220 1020 120 A device should not be reworked. Time (seconds) Storage Recommendations The recommended long term storage conditions for Multifuse Polymer PTC devices are 40 C maximum and 70 % RH maximum. All devices should remain in the original sealed packaging prior to use. Devices may not conform with data sheet specifications if these storage recommendations are exceeded. Devices stored in this manner have an indefinite shelf life. Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf. Temperature (C)