Features Applications n Surface Mount Device Provides overcurrent protection in: n Reduced footprint size n Customer Premise Equipment (CPE) n High voltage surge capabilities n Central Office (CO) n Assists in meeting ITU K.20/K.21/K.45 n Access/Outside Plant Equipment specifications n RoHS compliant* n Agency recognition: MF-SM013/250V - Telecom PTC Resettable Fuses Electrical Characteristics Max. One Hour Tripped Hold Initial Max. Interrupt Post-Trip Power Current Resistance Operating Ratings Resistance Dissipation Model Voltage Volts Amps Amps Ohms Ohms Ohms Watts (V) (A) at 23 C at 23 C at 23 C at 23 C at 23 C Volts Max. Max. I Min. Max. Max. Typ. H MF-SM013/250V 60 250 3.0 0.13 4.0 7.0 16.0 3.0 MF-SM013/250V-B5 60 250 3.0 0.13 9.0 12.0 20.0 3.0 Environmental Characteristics Operating Temperature ......................................... -40 C to +85 C Storage Condition ................................................. +40 C max. 70 % R.H. max. Passive Aging ....................................................... +85 C, 1000 hours ............................................... 15 % typical resistance change Humidity Aging...................................................... +85 C, 85 % R.H. 1000 hours ............................. 15 % typical resistance change Thermal Shock ..................................................... MIL-STD-202F, Method 107G, .............................. 15 % typical resistance change -55 C to +125 C,10 times Solvent Resistance ............................................... MIL-STD-202, Method 215B ................................. Marking still legible Vibration ............................................................... MIL-STD-883C, Method 2007.1, Condition A ....... 5 % typical resistance change Moisture Sensitivity Level (MSL) .......................... See Note ESD Classification - HBM ..................................... Class 6 Test Procedures And Requirements Test Test Conditions Accept/Reject Criteria Visual/Mech........................................................ Verify dimensions and materials ........................... Per MF physical description Resistance ............................................................ In still air 23 C ................................................. Rmin R Rmax Time to Trip ........................................................... At specified current, Vmax, 23 C ......................... T max. time to trip (seconds) Hold Current ......................................................... 30 min. at Ihold ..................................................... No trip Trip Cycle Life ....................................................... Vmax, Imax, 100 cycles ........................................ No arcing or burning Trip Endurance ..................................................... Vmax, 48 hours ..................................................... No arcing or burning Solderability .......................................................... 245 C 5 C, 5 seconds ...................................... >95 % coverage UL File Number .................................................... E174545 TV File Number .................................................. R50362083 Thermal Derating Chart - I /I (Amps) hold trip Ambient Operating Temperature Model -40 C -20 C 0 C 23 C 40 C 50 C 60 C 70 C 85 C MF-SM013/250V 0.22 0.19 0.16 0.13 0.105 0.090 0.075 0.060 0.040 MF-SM013/250V-B5 0.22 0.19 0.16 0.13 0.105 0.090 0.075 0.060 0.040 I is approximately two times I . trip hold WARNING Cancer and Reproductive Harm - www.P65Warnings.ca.gov *RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011. Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The products describedherein andthis document aresubject tospecific legal disclaimers as set forthon the last page of this document, andwww.bourns.com/docs/legal/disclaimer.pdf at .6.6 MAX. (.260) 7.4 (.291) MAX. 1.94 3.2 (.076) MF-SM013/250V - Telecom PTC Resettable Fuses (.126) MAX. Product Dimensions Recommended Pad Layout 6.6 2.29 3.43 2.29 MAX. (.260) (.090) (.090) (.135) 7.4 (.291) Terminal material: MAX. Tin-plated brass 2.41 2.41 (.095) (.095) 6.35 (.250) 1.94 3.2 (.076) (.126) Packaging Quantity MAX. MM DIMENSIONS: (INCHES) 1,000 pieces per reel 2.29 3.43 2.29 (.135) (.090) (.090) Solder Reflow Recommendations t Notes: p T P MF-SM013/250V models cannot be wave soldered or CRITICAL ZONE RAMP-UP hand soldered. Please contact Bourns for soldering TTO T L P 2.41 2.41 recommendations. (.095) (.095) T L All temperatures refer to topside of the package, measured 6.35 t on the package body surface. L (.250) If reflow temperatures exceed the recommended profile, T MAX. S devices may not meet the published specifications. RAMP-DOWN Compatible with Pb and Pb-free solder reflow profiles. Excess solder may cause a short circuit, especially during T MIN. S t hand soldering. Please refer to the Multifuse Polymer PTC s Soldering Recommendation guidelines. PREHEAT 25 t 25 C TO PEAK Time Profile Feature Pb-Free Assembly Average Ramp-Up Rate (Ts to T ) 3 C / second max. max p PREHEAT: Temperature Min. (Ts ) 150 C min Temperature Max. (Ts ) 200 C max Time (Ts to Ts ) (ts) 60~180 seconds min max TIME MAINTAINED ABOVE: Inspect solder joint to determine if solder joint is Process Time Temperature (T ) 217 C L Materials Temperature acceptable (i.e. exhibits wetting of joints surface). Description Interval Time (t ) 60~150 seconds L Use the following criteria (ref. acceptability of printed 1. Apply solder paste to Sn 96.5 / Ag 3.0 / Cu 0.5 Room temperature Peak Temperature (T ) 260 C board assemblies, IPC-A-610): p test board (8 - 10 mil thick) Alloy water soluble or no A) Acceptable (see Figure 1) Time within 5 C of Actual Peak Temperature (t ) 20~40 seconds clean solder pastep (see note 1) (1) The solder connection wetting angle (solder to Ramp-Down Rate 6 C / second max. single sided epoxy glass component and solder to PCB termination) Time 25 C to Peak Temperature 8 minutes max. (G10) (UL approved) does not exceed 90 . PC board approx. 4x4x.06 in. (2) Solder balls that do not violate minimum 2. Place test units onto board 6 units/board electrical clearances and are attached Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. (soldered) to a metal surface. 3. Ramp up Convection oven (see note 2) 2.5 C 0.5 /sec. The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf. B) Unacceptable (see Figure 2) 4. Preheat (T ) 150 C to 190 C 90 30 sec. S (1) Solder connection wetting angle exceeding 5. Time above liquidus (T ) 220 C 60-90 sec. L 90 . 6. Peak temperature (T ) 250 C +0 /-5 P (2) Incomplete reflow of solder paste. 10-20 sec. within 5 C of peak (3) Dewetting. 7. Ramp down Room temperature 3 C 0.5 C/sec. If unacceptable, determine cause and correct prior to (see note 2) next run. 8. Cleaning water clean profile High pressure deionized 72 F to 160 F As required NOTES: water 65 PSI max. (22 C to 71 C) 1. Water soluble solder paste only above 100K. 2. Refer to ref. temperature profile. Temperature at lead/pad junction with K type thermocouple. Temperature of Lead/Pad Junction 3. Units that are board mounted for environmental testing must see a peak temperature in the reflow (Derived using 6-zone Convection Oven) zone, as specified. This is to ensure that all test units will see worst case conditions. 4. Ramp down rate to be measured from 245 C to 150 C. 5. Process Description 8 does not apply to open frame trimmers. Temperature