Features RoHS compliant* and halogen free** Compliant with AEC-Q200 Rev-C- Stress Test Quali cation for Passive Components Agency recognition*** in Automotive Applications Fast tripping resettable circuit protection Surface mount packaging for automated assembly Small footprint size (1210) MF-USMF Series - PTC Resettable Fuses Electrical Characteristics Tripped Max. Time I I Resistance Power hold trip To Trip Dissipation V max. I max. Model Volts Amps Amperes Ohms Amperes Seconds Watts at 23 C at 23 C at 23 C at 23 C at 23 C R R Hold Trip Typ. Min. 1Max. MF-USMF005 30 10 0.05 0.15 2.800 50.000 0.25 1.50 0.6 MF-USMF010 30 10 0.10 0.30 0.800 15.000 0.50 0.60 0.6 MF-USMF020 30 10 0.20 0.40 0.400 5.000 8.00 0.02 0.6 MF-USMF035 6 40 0.35 0.75 0.200 1.300 8.00 0.20 0.6 MF-USMF050 13.2 40 0.50 1.00 0.180 0.900 8.00 0.10 0.6 MF-USMF075 6 40 0.75 1.50 0.070 0.450 8.00 0.10 0.6 MF-USMF110 6 40 1.10 2.20 0.050 0.210 5.00 1.00 0.6 MF-USMF150 6 40 1.50 3.00 0.030 0.110 5.00 5.00 0.6 MF-USMF175X*** 6 40 1.75 3.50 0.020 0.090 8.00 1.00 0.7 *** CSA approval pending. Environmental Characteristics Operating Temperature ......................................... -40 C to +85 C Maximum Device Surface Temperature in Tripped State .................................................... 125 C Passive Aging ....................................................... +85 C, 1000 hours ............................................... 5 % typical resistance change Humidity Aging...................................................... +85 C, 85 % R.H. 1000 hours ............................. 5 % typical resistance change Thermal Shock ..................................................... +85 C to -40 C, 20 times .................................... 10 % typical resistance change Solvent Resistance ............................................... MIL-STD-202, Method 215 ................................... No change Vibration ............................................................... MIL-STD-883C, Method 2007.1, ........................... No change Condition A Test Procedures And Requirements For Model MF-USMF Series Test Test Conditions Accept/Reject Criteria Visual/Mech........................................................ Verify dimensions and materials ........................... Per MF physical description Resistance ............................................................ In still air 23 C ................................................. Rmin R R1max Time to Trip ........................................................... At speci ed current, Vmax, 23 C ......................... T max. time to trip (seconds) Hold Current ......................................................... 30 min. at Ihold ..................................................... No trip Trip Cycle Life ....................................................... Vmax, Imax, 100 cycles ........................................ No arcing or burning Trip Endurance ..................................................... Vmax, 48 hours ..................................................... No arcing or burning Solderability .......................................................... ANSI/J-STD-002 ................................................... 95 % min. coverage UL File Number .................................................... E174545 Applications Game consoles PC motherboards USB port protection - USB 2.0, 3.0 & OTG HDMI 1.4 Source protection IEEE 1394 ports Mobile phones Digital cameras MF-USMF Series - PTC Resettable Fuses Product Dimensions AB C D Model Min. Max. Min. Max. Min. Max. Min. 3.00 3.43 2.35 2.80 0.80 1.1 0.30 MF-USMF005 (0.118) (0.135) (0.093) (0.110) (0.031) (0.043) (0.012) 3.00 3.43 2.35 2.80 0.80 1.1 0.30 MF-USMF010 (0.118) (0.135) (0.093) (0.110) (0.031) (0.043) (0.012) 3.00 3.43 2.35 2.80 0.80 1.1 0.30 MF-USMF020 (0.118) (0.135) (0.093) (0.110) (0.031) (0.043) (0.012) 3.00 3.43 2.35 2.80 0.55 0.85 0.30 MF-USMF035 (0.118) (0.135) (0.093) (0.110) (0.022) (0.033) (0.012) 3.00 3.43 2.35 2.80 0.55 0.85 0.30 MF-USMF050 (0.118) (0.135) (0.093) (0.110) (0.022) (0.033) (0.012) 3.00 3.43 2.35 2.80 0.55 0.85 0.30 MF-USMF075 (0.118) (0.135) (0.093) (0.110) (0.022) (0.033) (0.012) 3.00 3.43 2.35 2.80 0.55 0.85 0.30 MF-USMF110 (0.118) (0.135) (0.093) (0.110) (0.022) (0.033) (0.012) 3.00 3.43 2.35 2.80 0.40 0.85 0.30 MF-USMF150 (0.118) (0.135) (0.093) (0.110) (0.016) (0.033) (0.012) 3.00 3.43 2.35 2.80 0.40 0.85 0.30 MF-USMF175X (0.118) (0.135) (0.093) (0.110) (0.016) (0.033) (0.012) Packaging: 3000 pcs. per reel. MM DIMENSIONS: (INCHES) Recommended Pad Layout Top and Bottom View Side View Terminal material: 1.0 0.05 1.0 0.05 A Electroless Ni under immersion Au C (.039 .002) (.039 .002) Termination pad solderability: 2.5 0.1 Standard Au nish: (.098 .004) B Meets ANSI/J-STD-002 Category 2. 2.0 0.1 Recommended Storage: (.079 .004) 40 C max./70 % RH max. D Solder Re ow Recommendations Preheating Soldering Cooling 300 Notes: MF-USMF models cannot be wave soldered. 250 If re ow temperatures exceed the recommended pro le, devices may not meet the performance requirements. 200 Compatible with Pb and Pb-free solder re ow pro les. Excess solder may cause a short circuit, especially during hand 150 soldering. Please refer to the Multifuse Polymer PTC Soldering Recommendation guidelines. 100 50 0 160220 1020 120 Time (seconds) Speci cations are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their speci c applications. Temperature (C)