Features Applications n Normal open contact system n PC interface boards n Low contact resistance n LANs n High reliability n Auto dialing systems n Self-clean on contact area n Remote controlled systems SDS/SDP/SDA Series Slide DIP Switch Electrical Characteristics Product Dimensions Electrical Life ............2,000 operations min. SDS Series SDP Series per switch, 24VDC, 25mA A +.0.20/ -0 Non-Switching Rating ........100mA, 50VDC A +.0.20/ -0 3.50 (A + .008/-0) (A + .008/-0) (.138) Switching Rating ..................25mA, 24 VDC Contact Resistance ( current 100mA) ........................50 milliohms max. at initial ON DIP 100 milliohms max. after life test 10.8 (.425) Insulation Resistance at 500VDC 15V............100 megohms min. 1 2 3 4 5 6 7 8 between adjacent terminals Dielectric Strength..............500VDC/minute 9.90 + 0.20/-0 10.20 Capacitance ..................5pF max. between 1.30 C MAX. L (.390 + .008/-0) (.402) (.051) adjacent terminals 6.90 MAX. Circuit ....................Single pole single throw 1.40 (.272) 1.0 (.055) (.039) Environmental Characteristics 1 2 3 4 5 6 7 8 Mechanical Life..2,000 operations per switch DIP ON Operation Force ..........................800g max. Stroke................................................2.0mm Operating Temp. Range......-40C to +85C 2.05 Storage Temperature ..........-40C to +85C 0.60 2.54 (.081) (.024) Vibration Test ......................MIL-STD-202F, (.100) TYP. 3.20 Method 201A B 1.95 0.60 2.54 3.20 MIN. (.126) Frequency ..............10-55-10 Hz/1 minute (.077) (.024) (.126) MIN. (.100) TYP. B Directions ................X,Y,Z, three mutually 12.57 (.495) perpendicular directions Time......................2 hours each direction. 1.60 High reliability (.063) 30 Shock Test ..........................MIL-STD-202F, Method 213B, Condition A Gravity ............50G (peak value), 11 msec Direction & Times....................6 sides and 3 times in each direction. 1.84 0.15 High reliability (.072) 7.62 0.50 (.006) 7.62 0.50 0.15 (.300 .020) Physical Characteristics (.300 .020) (.006) SDPX SERIES SDPR SERIES Base and Cover Materials SDSX SERIES SDSR SERIES ..UL94V-0 PBT plus glass fiber reinforced Color ......................Black base, red cover RECOMMENDED PCB LAYOUT Actuator Materials..................UL94V-0 PBT RECOMMENDED PCB LAYOUT B 0.10 = 2.54 x (P-1) plus glass fiber reinforced (B .004 = .100 x (P-1)) B 0.10 = 2.54 x (P-1) Color ................................................White (B .004 = .100 x (P-1)) Contact Materials ....Phosphor bronze with 3 micro inches gold plating over nickel Top Seal Materials..................Polyester film Potting Materials................................Epoxy Wave Soldering Process* ......Recommended solder temp. at 260C 7.62 0.10 0.97 0.05 (500F) max., 5 sec. DIA. (.038 .002) (.300 .004) 7.62 0.10 Hand Soldering Process* 0.97 0.05 DIA. (.300 .004) ................Use a soldering iron of 30 watts (.038 .002) or less, controlled at 320C (608F) for SCHEMATIC (TYP.) 2,3,4,5,6,7,8,9,10,12 POSITIONS AVAILABLE approx. 2 sec. while applying solder SCHEMATIC (TYP.) Cleaning Process* 2,3,4,5,6,7,8,9,10,12 POSITIONS AVAILABLE ..............Flux clean using force rinse, high agitation or triple bath cleaning method. Freon TF or TE give excellent results. When vapor methods are used, do not SEE FOLLOWING PAGE FOR A & B DIMENSION CHART. subject the switch to solvents at SEE FOLLOWING PAGE FOR A & B DIMENSION CHART. temperatures above 51C (125F). Standard Packaging MM DIMENSIONS: ......IC tubes/all poles in the off position (IN) *For best results, keep all switch contacts in their off position for all operations. Specifications are subject to change without notice. 371