SF-1206S500W-2 Bourns

I SinglFuse SF-1206SxxxW Series Features n Single blow fuse for overcurrent protection n 3216 (EIA 1206) footprint n Slow blow fuse n UL 248-14 listed n RoHS compliant* and halogen free** n Wire core SMD design n Surface mount packaging for automated assembly SF-1206SxxxW Series - Slow Blow Wire Core Surface Mount Fuses Electrical Characteristics Rated Current Resistance Rated Interrupting Typical Model Fusing Time 2 2 (Amps) () Typ.*** Voltage Rating I t (A s) **** SF-1206S150W-2 1.50 0.050 0.37 SF-1206S160W-2 1.60 0.043 0.52 SF-1206S200W-2 2.00 0.032 0.88 SF-1206S250W-2 2.50 0.028 DC 65 V 1.10 DC 65 V 50 A SF-1206S300W-2 3.00 0.022 1.90 SF-1206S315W-2 3.15 0.020 2.20 SF-1206S350W-2 3.50 Open within 5 0.018 2.60 SF-1206S400W-2 4.00 sec. at 250 % 0.016 3.30 rated current SF-1206S500W-2 5.00 0.013 5.40 SF-1206S630W-2 6.30 0.010 8.90 SF-1206S700W-2 7.00 0.0092 10.40 DC 32 V SF-1206S800W-2 8.00 0.0084 DC 32 V 13.50 50 A SF-1206S1000W-2 10.00 0.0050 11.20 SF-1206S1200W-2 12.00 0.0041 15.00 SF-1206S1500W-2 15.00 0.0035 24.50 *** Resistance value measured with 10 % rated current at 25 C ambient. 2 **** Melting I t calculated at 0.001 second pre-arcing time. Reliability Testing No. Test Requirement Test Condition Test Reference DCR change 20 % ( 10 % for 1 A) 3 reflows at 245 C followed by a Refer to STP 1 Reflow and bend No mechanical damage 2 mm bend document MIL-STD-202 2 Solderability Minimum 90 % coverage One dip at 245 C for 5 seconds Method 208 Soldering heat DCR change 20 % ( 10 % for 1 A) MIL-STD-202 3 One dip at 260 C for 10 seconds resistance New solder coverage 75 % Method 210 DCR change 15 % MIL-STD-202 4 Moisture resistance 10 cycles No excessive corrosion Method 106 DCR change 10 % MIL-STD-202 5 Salt spray 48 hour exposure, 5 % salt solution No excessive corrosion Method 101 DCR change 10 % 0.4 inch D.A. or 30 G between MIL-STD-202 6 Mechanical vibration No mechanical damage 5-3000 Hz Method 204 DCR change 10 % MIL-STD-202 7 Mechanical shock 1500 G, 0.5 ms, half-sine shocks No mechanical damage Method 213 DCR change 10 % MIL-STD-202 8 Thermal Shock 100 cycles between -65 C and +125 C No mechanical damage Method 107 No electrical opens during testing 80 % rated current (75 % for < 1 A fuses) Refer to STP 9 Life Voltage drop change shall be less for 2000 hours at ambient temperature document than 20 % of initial value +25 C Agency Recognition * RoHS Directive 2015/863, Mar 31, 2015 and Annex.. ** Bourns considers a product to be halogen free if (a) the Bromine (Br) content UL File Number .................................................... E198545 is 900 ppm or less (b) the Chlorine (Cl) content is 900 ppm or less and (c) the total Bromine (Br) and Chlorine (Cl) content is 1500 ppm or less. SinglFuse SF-1206SxxxW Series Applications n Low voltage lighting power n LCD monitors n Industrial controllers n Backlight drivers n Set top boxes n DC/DC converters n Notebooks / ultrabooks SF-1206SxxxW Series - Slow Blow Wire Core Surface Mount Fuses Environmental Characteristics Operating Temperature ................................................................................................................................................................ -55 C to +125 C Storage Conditions Temperature .............................................................................................................................................................................. +5 C to +35 C Humidity.........................................................................................................................................................................................40 % to 75 % Shelf Life..........................................................................................................................................................2 years from manufacturing date Moisture Sensitivity Level ...................................................................................................................................................................................... 1 ESD Classification (HBM) ............................................................................................................................................................................ Class 6 Typical Part Marking How to Order Construction SF - 1206 S 150 W - 2 Represents total content. Layout may FR4 PCB vary. Cu/Ni/Sn SinglFuse TERMINATION Product Designator SMD Footprint 1206 = 3216 (EIA1206) size G Fuse Blow Type S = Slow Blow RATED CURRENT (A) Rated Current FUSE ELEMENT G = 1.50 N = 5.00 (Cu or Cu alloy) 150 ~ 1500 (1.50 A ~ 15.00 A) T = 1.60 O = 6.30 I = 2.00 P = 7.00 Structure Type J = 2.50 R = 8.00 W = Wire Core Packaging Quantity K = 3.00 Q = 10.00 Packaging Type V = 3.15 X = 12.00 3,500 pieces per 7-inch reel - 2 = Tape & Reel L = 3.50 Y = 15.00 M = 4.00 Product Dimensions Recommended Pad Layout 3.20 0.20 3.20 0.20 MM (.126 .008) DIMENSIONS: (.126 .008) 1.50 (INCHES) 1.50 1.08 0.15 1.08 0.15 (.059) (.059) (.042 .006) (.042 .006) 1.80 1.80 1.60 + 0.30 / - 0.20 1.60 + 0.30 / - 0.20 (.071) (.071) (.063 + .012 / - .004) (.063 + .012 / - .004) 4.40 4.40 (.173) (.173) 0.85 0.30 0.85 0.30 0.85 0.30 0.85 0.30 0.85 0.30 0.85 0.30 0.85 0.30 0.85 0.30 (.033 .012) (.033 .012) (.033 .012) (.033 .012) (.033 .012) (.033 .012) (.033 .012) (.033 .012) Current Rating Thermal Derating Curve 105 100 95 90 85 80 75 70 65 60 55 50 -55 -35 -15 5 25 45 65 85 105 125 MAXIMUM OPERATING TEMPERATURE (C) Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. DERATING (%)