SRE6603-3R3M Bourns

222 Features Applications n Unit height of 2.9 mm n DC/DC converters n Inductance range: 1500 to 10,000H n Power supplies for: n Rated current up to 0.12 A Portable communication equipment n RoHS compliant* Laptop computers Camcorders, HDTV SRE6603 Series - Shielded SMD Power Inductors Electrical Characteristics General Specifications Test Voltage ....................................0.1 V Inductance Reflow Soldering ... 230 C, 50 sec max. 100 KHz Test SRF DCR L ( H) Q Freq. (MHz) (W) I rms I sat **K Operating Temperature Bourns Part No. 20 % (Ref.) (KHz) Typ. Max. (A) (A) -Factor ................................-25 C to +105 C SRE6603-152M 1500 50 100 2 4.2 0.12 0.035 82 (Temperature rise included) SRE6603-222M 2200 50 100 2 8.5 0.10 0.028 68 Storage Temperature ................................-40 C to +125 C SRE6603-332M 3300 50 100 1 11 0.08 0.024 53 Resistance to Soldering Heat SRE6603-472M 4700 50 100 1 13.9 0.06 0.021 48 ...............................260 C for 10 sec. SRE6603-682M 6800 50 100 1 25 0.04 0.019 37 Moisture Sensitivity Level .....................1 SRE6603-103M 10,000 50 100 0.8 32.8 0.02 0.017 31 ESD Classification (HBM) ................. N/A **K-Factor: To calculate core flux density, Bp-p (gauss) = K x L(H) x I (peak-to-peak ripple current, A), determine core loss from Core Loss vs. Flux Density plot. 6.60 Materials (0.260) MAX. Core ..............................................Ferrite Core Loss vs. Flux Density Wire ............................Enameled copper Base ..........................................Ceramic 4.45 Adhesive .............................. Epoxy resin (0.175) Terminal ....................................Ag/Ni/Au MAX. Rated Current 10 ...............Ind. drop of 30 % typ. at Isat Temperature Rise ...40 C typical at Irms 1.27 0.2 Packaging ..... 2000 pcs. per 13-inch reel (0.050 0.008) 1 MHz 1 Product Dimensions 800 KHz 500 KHz 6.60 400 KHz (0.260) 300 KHz 4.32 0.3 MAX. 200 KHz (0.170 0.012) 0.1 100 KHz 1.02 0.2 (0.040 0.008) 4.45 (0.175) MAX. 3.90 0.3 0.01 (0.154 0.012) 2.92 (0.115) MAX. 1.27 0.2 (0.050 0.008) 0.001 100 1000 10000 Flux Density Bp-p (gauss) 4.32 0.3 (0.170 0.012) Schematic Recommended Layout 1.02 0.2 (0.040 0.008) 3.56 6.86 REF. (0.270) (0.140) 3.90 0.3 (0.154 0.012) 2.92 (0.115) MAX. 4.06 (0.160) 1.4 1.4 (0.055) (0.055) MM DIMENSIONS: (INCHES) *RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011. Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. 6.86 3.56 REF. Users should verify actual device performance in their specific applications. (0.270) (0.140) 4.06 (0.160) 1.4 1.4 (0.055) (0.055) *RoHS COMPLIANT VERSIONS AVAILABLE *RoHS COMPLIANT LEAD FREE LEAD FREE VERSIONS ARE RoHS COMPLIANT* Core Loss (mW) SRE6603 Series - Shielded SMD Power Inductors Soldering Profile 275 275 260 C peak <1>Maximum of 10 seconds <1>5 seconds maximum <1> 255 C <1> 245 C between +255 C and +260 C at +245 C 225 225 220 C 170 C 190C Ramp Down 60 seconds 183 C maximum 5 C/second 175 175 150 C 150 C 60 seconds maximum Ramp Down 5 C/second 125 125 120-150seconds 120-150 seconds 10 secondsminimum 10 secondsminimum 75 75 Ramp Up Ramp Up 4 C/second maximum 4 C/second maximum 25 25 050 100 150200 250300 050100 150200 250300 Time (Seconds) Time (Seconds) Packaging Specifications 330.0 2.0 0.5 (13.00) (.079 .020) DIA. THICKNESS 0.10 13.5 0.5 (.004) (0.53 .020) MAX. DIA. EMBOSSED 100.0 2.0 CAVITY (3.94 .079) 13.5 0.5 DIA. (.53 .020) EMBOSSED CARRIER 16.5 0.5 (0.65 0.020) 4.0 0.1 2.0 0.1 1.5 0.1 1.75 0.1 (0.079 0.004) (0.157 0.004) (0.059 0.004) (0.069 0.004) 16.0 0.3 (0.629 0.012) 6.7 0.1 (0.264 0.004) 7.5 0.1 (0.295 0.004) 8.0 0.1 0.35 0.05 (0.315 0.004) (0.014 0.002) MM 4.4 0.1 DIMENSIONS: (INCHES) (0.173 0.004) 3.2 0.1 (0.126 0.004) USER DIRECTION OF FEED QTY: 2000 PCS. PER REEL REV. 03/18 Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. Temperature(C) Temperature(C)