HCPL-520x, HCPL-523x, HCPL-623x, 1 HCPL-625x, 5962-88768 and 5962-88769 Hermetically Sealed Low IF, Wide VCC, Logic Gate Optocouplers Data Sheet Description Features These units are single, dual and quad channel, hermetically Dual marked with device part number and DLA Standard sealed optocouplers. The products are capable of operation Microcircuit Drawing (SMD) and storage over the full military temperature range and can Manufactured and tested on a MIL-PRF-38534 certified line be purchased as either commercial product or with full QML-38534, Class H and K MIL-PRF-38534 Class Level H or K testing or from the Four hermetically sealed package configurations appropriate DLA Standard Microcircuit Drawing (SMD). All Performance guaranteed over 55C to +125C devices are manufactured and tested on a MIL-PRF-38534 Wide V range (4.5V to 20V) certified line, and Class H and K devices are included in the DLA CC Qualified Manufacturers List QML-38534 for Hybrid 350 ns maximum propagation delay Microcircuits. CMR: > 10,000 V/s typical 1500 Vdc withstand test voltage Each channel contains an AlGaAs light emitting diode that is optically coupled to an integrated high gain photon detector. Three-state output available The detector has a threshold with hysteresis, which provides High radiation immunity differential mode noise immunity and eliminates the potential HCPL-2200/31 function compatibility for output signal chatter. The detector in the single-channel Reliability data available units has a tri-state output stage that allows for direct Compatible with LSTTL, TTL, and CMOS logic connection to data buses. The output is noninverting. The detector IC has an internal shield that provides a guaranteed common mode transient immunity of up to 10,000 V/s. Applications Improved power supply rejection eliminates the need for Military and space special power supply bypass precautions. High reliability systems Transportation and life critical systems High-speed line receiver Isolated bus driver (single channel) Pulse transformer replacement CAUTION It is advised that normal static precautions be Ground loop elimination taken in handling and assembly of this Harsh industrial environments component to prevent damage and/or Computer-peripheral interfaces degradation which may be induced by ESD. 1. See Selection GuidePackage Styles and Lead Configuration Options for available extensions. Broadcom - 1 -HCPL-520x, HCPL-523x, HCPL-623x, HCPL-625x, 5962-88768 and 5962-88769 Functional Diagram Data Sheet Functional Diagram Truth Tables Multiple-channel devices are available. (Positive Logic) V Multichannel Devices CC V O Input Output On (H) H V E Off (L) L GND Single Channel Devices Package styles for these parts are 8-pin DIP through hole (case Input Enable Output outline P), 16-pin DIP flat pack (case outline F), and leadless ceramic chip carrier (case outline 2). Devices can be purchased On (H) H Z with a variety of lead bend and plating options. See Selection GuidePackage Styles and Lead Configuration Options for Off (L) H Z details. Standard Microcircuit Drawing (SMD) parts are On (H) L H available for each package and lead style. Because the same electrical die (emitters and detectors) are Off (L) L L used for each channel of each device listed in this data sheet, absolute maximum ratings, recommended operating conditions, electrical specifications, and performance characteristics shown in the figures are identical for all parts. NOTE A 0.1-F bypass capacitor must be connected Occasional exceptions exist due to package variations and between V and GND pins. CC limitations and are as noted. Additionally, the same package assembly processes are used in all devices. These similarities give justification for the use of data obtained from one part to represent other parts performance for die related reliability and certain limited radiation test results. Functional Diagrams 8-Pin DIP 8-Pin DIP 16-Pin Flat Pack 20-Pad LCCC Through Hole Through Hole Unformed Leads Surface Mount 1 Channel 2 Channels 4 Channels 2 Channels 15 V 1 8 V 8 CC 1 CC 1 16 V CC2 V O1 V 15 19 13 V 2 CC V O2 O 2 7 2 7 20 12 3 V 14 O1 GND 2 V O2 3 6 4 V 13 3 6 O2 V V E CC1 2 10 V O1 V 12 5 O3 4 5 4 5 3 GND GND 6 V 11 O4 GND 1 7 GND 10 7 8 8 9 NOTE Multichannel DIP and flat pack devices have common V and ground. Single-channel DIP has an enable pin 6. CC LCCC (leadless ceramic chip carrier) package has isolated channels with separate V and ground connections. CC All diagrams are top view. Broadcom - 2 -