X-On Electronics has gained recognition as a prominent supplier of WF-1D254A3P Headers & Wire Housings across the USA, India, Europe, Australia, and various other global locations. WF-1D254A3P Headers & Wire Housings are a product manufactured by BXCONN. We provide cost-effective solutions for Headers & Wire Housings, ensuring timely deliveries around the world.

WF-1D254A3P BXCONN

WF-1D254A3P electronic component of BXCONN
Images are for reference only
See Product Specifications
Part No.WF-1D254A3P
Manufacturer: BXCONN
Category: Headers & Wire Housings
Description: P=2.5mm Housings (Wire To Board / Wire To Wire ) ROHS
Datasheet: WF-1D254A3P Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
100: USD 0.0053 ea
Line Total: USD 0.53 
Availability - 581
Ship by Mon. 09 Dec to Thu. 12 Dec
MOQ: 100  Multiples: 100
Pack Size: 100
Availability Price Quantity
581
Ship by Mon. 09 Dec to Thu. 12 Dec
MOQ : 100
Multiples : 100
100 : USD 0.0053
1000 : USD 0.0052
10000 : USD 0.005

   
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We are delighted to provide the WF-1D254A3P from our Headers & Wire Housings category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the WF-1D254A3P and other electronic components in the Headers & Wire Housings category and beyond.

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