Type CC Low Resistance Precision Chip Resistors Page 1 of 2 Style FC - Flip Chip version for surface mount applications. Style WB - Wire Bond version for hybrid applications with metallized back surface for solder down heat sinking of the chip, includes bondable termination pads to receive aluminum wire bonds. Thermal resistance is provided to optimize high power designs when utilizing higher thermal conductivity circuit board substrates such as IMS or Alumina. Resistance range down to 0.010 ohm at 5%, 0.050 ohm at 2%, and 0.10 ohm at 1%. Low inductance provides excellent high frequency and pulse response. High pulse handling and overload capability. Best choice for switching power supplies, motor speed controls, and high current sensing applications. Style FC - Flip Chip Version is a surface mount version with solderable pads for flip chip soldering. Power Capability Information Resistance Dimensions in inches and (millimeters) High Power Applications General Applications Comments Power Rating Thermal Resistance - R Max. Chip JC Model Temperature at 70 C Film (J) to Solder Pad (C) Min. Max. A B C D (see note 1) (see note 2) .035 min150 .007 .120 .007 .027 .005 0.75 Watt Solder Coated Pads 0.010 0.015 22.7C/Watt 150C (0.89 min.) (3.81 .18) (3.05 .18) (.69 .13) CC1512FC .035 min150 .007 .120 .007 .022 .003 0.75 Watt 0.020 10.0 22.7C/Watt 150C Solderable Pads (0.89 min.) (3.81 .18) (3.05 .18) (.56 .08) .050 min200 .007 .150 .007 .027 .003 CC2015FC 1.0 Watt Solderable Pads 0.020 10.0 16.0C/Watt 150C (1.27 min.) (5.08 .18) (3.81 .18) (.69 .08) .065 min250 .007 .200 .007 .032 .005 1.5 Watts Solder Coated Pads 0.010 0.020 13.0C/Watt 150C (1.66 min.) (6.35 .18) (5.08 .18) (.81 .13) CC2520FC .040 min250 .007 .200 .007 .041 .004 1.5 Watts Solderable Pads 0.025 10.0 11.5C/Watt 150C (1.02 min.) (6.35 .18) (5.08 .18) (1.04 .10) CC1512FC Standard Resistance Values: Style FC Derating Curve For General Applications Tolerance CC1512FC 1% Standard (except as noted). 0.010 5% 0.033 5% 0.20 0.75 3.30 100 Note 1: General Applications - The power rating 0.015 5% 0.040 5% 0.25 1.00 4.00 for general applications is based upon 0.5 sq. in. 0.020 5% 0.050 2% 0.30 1.50 5.00 80 2 0.025 5% 0.075 2% 0.33 2.00 7.50 (300 mm ) of termination pad or trace area (2 oz. 60 0.030 5% 0.10 0.40 2.50 8.00 copper) connected to each end of the resistor. 0.15 0.50 3.00 10.0 40 Maximum chip temperature is 150C. Use Derating CC2015FC Standard Resistance Values: Curve to derate appropriately for the maximum 20 Tolerance CC2015FC 1% Standard (except as noted). ambient temperature and for the temperature 0 0.020 5% 0.033 5% 0.20 0.75 3.30 limitations of the adjacent materials. 25 70 100 150 0.025 5% 0.040 5% 0.25 1.00 4.00 o AMBIENT TEMPERATURE, C 0.030 5% 0.050 2% 0.30 1.50 5.00 0.075 2% 0.33 2.00 7.50 0.10 0.40 2.50 8.00 Note 2: Thermal Resistance - In High Power Applications where the circuit board 0.15 0.50 3.00 10.0 material provides high heat sinking benefits (such as IMS, Alumina, or other) the thermal CC2520FC Standard Resistance Values: resistance of the chip resistor is useful to establish the maximum power capability of the Tolerance CC2520FC 1% Standard (except as noted). chip resistor in the application. The film temperature is measured at the center of the 0.010 5% 0.033 5% 0.75 3.30 0.20 resistor element and the solder pad temperature is measured at the center of the 0.015 5% 0.040 5% 1.00 4.00 0.25 termination pad (point X in the recommended circuit layouts shown below). Maximum 0.020 5% 0.050 2% 1.50 5.00 0.30 temperature of the chip resistor (at the center of chip) should not exceed 150C through 0.025 5% 0.075 2% 2.00 7.50 0.33 0.030 5% 0.10 2.50 8.00 0.40 the temperature range of the application. 0.15 3.00 10.0 0.50 Recommended Circuit Board Layout Custom resistance values and non-standard tolerances can be manufactured for high quantity applications. (current and sense connections): Please contact Caddock Applications Engineering. Fig. 1A: Kelvin layout recom- C C Fig. 1B: Kelvin layout C C C mended for values below 0.20 recommended for higher X X resistance values. C = Current connection X X S = Sense connection S S S S Note: Actual width of current trace is based on magnitude of current. Point of connection should be in the area shown. Sales and Applications Engineering 17271 North Umpqua Hwy. ELECTRONICS, INC. Roseburg, Oregon 97470-9422 e-mail: caddock caddock.com web: www.caddock.com Phone: (541) 496-0700 For Caddock Distributors listed by country see caddock.com/contact/dist.html Fax: (541) 496-0408 2003-2017 Caddock Electronics, Inc. 28 IL106.0717 RATED LOAD, %Type CC Low Resistance Precision Chip Resistors Page 2 of 2 Style WB - Wire Bond Version is a hybrid mountable version with metallized pads for wire bonding utilizing aluminum wire and a metallized back surface for solder attachment of the back surface to a heat sinking substrate. Power Capability Information Resistance Dimensions in inches and (millimeters) Thermal Resistance Comments R Max. Chip JC Model Film (J) to Solder Pad (C) Temperature Min. Max. A B C D (see note 3) .050 min200 .007 .150 .007 .027 .003 CC2015WB Aluminum wire to be used for bonding 0.020 10.0 13.9C/Watt 150C (1.27 min.) (5.08 .18) (3.81 .18) (.69 .08) .040 min250 .007 .200 .007 .027 .003 CC2520WB Aluminum wire to be used for bonding 0.025 10.0 8.33C/Watt 150C (1.02 min.) (6.35 .18) (5.08 .18) (.69 .08) Note 3: Thermal Resistance - In High Power Applications where the circuit board material CC2015WB Standard Resistance Values: provides high heat sinking benefits (such as IMS, Alumina, or other) the thermal resistance of Tolerance CC2015WB 1% Standard (except as noted). the chip resistor is useful to establish the maximum power capability of the chip resistor in the 0.020 5% 0.050 2% 0.25 0.75 3.30 application. The film temperature is measured at the center of the resistor element and the 0.025 5% 0.075 2% 0.30 1.00 4.00 0.030 5% 0.10 0.33 1.50 5.00 solder pad temperature is measured at the soldered interface with the circuit board. Maximum 0.033 5% 0.15 0.40 2.00 7.50 temperature of the chip resistor (at the center of chip) should not exceed 150C through the 0.040 5% 0.20 0.50 2.50 8.00 temperature range of the application. 3.00 10.0 CC2520WB Standard Resistance Values: Location for Sense (Potential) Connection: Tolerance CC2520WB 1% Standard (except as noted). Sense connection shall be Film Temperature 0.025 5% 0.050 2% 0.25 0.75 3.30 Measuring Point made in the crosshatched 0.030 5% 0.075 2% 0.30 1.00 4.00 Sense Wire Sense Wire 0.033 5% 0.10 0.33 1.50 5.00 portion of the termination 0.040 5% 0.15 0.40 2.00 7.50 pad. Current Wire Current Wire 0.20 0.50 2.50 8.00 Solder pad, soldered 3.00 10.0 .055 (1.40) centered interface with circuit board. Custom resistance values and non-standard tolerances can be manufactured for high quantity applications. Circuit board: IMS, Ceramic (Alumina) , or other. Please contact Caddock Applications Engineering. WB Resistor mounting General Information for Type CC - Style FC and Style WB - Chip Resistors Specifications: Packaging information: Solder attachment note: Temperature Coefficient: TC referenced to Style FC, flip chip resistors, are shipped with the bare +25C, R taken at +150C. Style FC has a bare ceramic back surface. ceramic side up in the pocket, with the solderable pads fac- The recommended solders for flip chip ing down. 0.50 ohm and above, -20 to +80 ppm/C Style WB, wire bondable resistors, are shipped with the solder attachment are 62Sn / 36Pb / 2Ag, 0.050 ohm to 0.49 ohm, 0 to +200 ppm/C wire bondable pads facing up in the pocket. 96.5Sn / 3.5Ag, or standard Sn / Ag / Cu below 0.050 ohm, 0 to +300 ppm/C. The illustration shows the orientation of the CC1512 and solder alloys. CC2015 chip resistors in the tape. The CC2520 chip resistors Inductance: Less than 5 nH typical. Style WB has a metallized back surface for are rotated 90 from what is shown in the illustration. 7 dia. Load Life: 1000 hours at rated power, based soldering to a substrate or a heat sink. The (178 mm) upon 150C max. chip temperature, recommended solders to be used are 12mm 0.473 Bo R (0.5% + 0.0005 ohm). 62Sn / 36Pb / 2Ag, 96.5Sn / 3.5Ag, or standard Sn / Ag / Cu solder alloys. Momentary Overload: 1.5 times rated power, Ao for 5 seconds, R (0.5% + 0.0005 ohm). Ko signifies tape thickness and dimension Operating Temperature: -55C to +150C. Ordering .512 arbor hole Physical Size (13mm) Measurement Note: All measurements are Information: 1512 = 0.150 x 0.120 2015 = 0.200 x 0.150 taken using Kelvin connections per the Size 1512 Size 2015 Size 2520 2520 = 0.250 x 0.200 recommended connection locations. Ao 0.135 (3.43mm) 0.189 (4.80mm) 0.271 (6.88mm) CC 2520 FC - 0.10 - 1% Bo 0.167 (4.24mm) 0.209 (5.31mm) 0.216 (5.49mm) Tolerance: Ko 0.037 (0.94mm) 0.087 (2.21mm) 0.066 (1.68mm) Type CC 5% below 0.050 Carrier Tape and pocket dimensions: A 2% 0.050 to 0.099 Style: Tape is 12mm Carrier Tape (8mm pitch) 1% 0.10 and above C FC or WB D Resistor Value () Full reel quantities: See charts for availability 1500 pieces per reel for CC1512 1000 pieces per reel for CC2015 and CC2520 B Quantities of less than 250 will be shipped in tape without reel and without tape leader at the option of Caddock. Tape dimensions and materials will be consistent with EIA-481-1. Dimensions in inches and (millimeters) Reels will be marked with a label containing Caddock logo, part number, resistor value, tolerance, packaging date, and quantity. Sales and Applications Engineering 17271 North Umpqua Hwy. ELECTRONICS, INC. Roseburg, Oregon 97470-9422 e-mail: caddock caddock.com web: www.caddock.com Phone: (541) 496-0700 For Caddock Distributors listed by country see caddock.com/contact/dist.html Fax: (541) 496-0408 2003-2017 Caddock Electronics, Inc. 28 IL106.0717