X-On Electronics has gained recognition as a prominent supplier of ZICM3588SP2-2-R across the USA, India, Europe, Australia, and various other global locations. ZICM3588SP2-2-R are a product manufactured by California Eastern. We provide cost-effective solutions for ZICM3588SP2-2-R, ensuring timely deliveries around the world.

ZICM3588SP2-2-R California Eastern

Name: ZICM3588SP2-2-R
Brand: California Eastern
SKU: ZICM3588SP22R_California Eastern
Availability: OutOfStock
Rating: 5 (11 reviews)

ZICM3588SP2-2-R electronic component of California Eastern

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Part No.	ZICM3588SP2-2-R
Manufacturer:	California Eastern
Category:	Unclassified
Description:	MESHCONNECT EM358 MINI MODULE, +20 DBM, ZIGBEE / 802.15.4, EMBER IC EM3588 / PCB ANTENNA / 2ND GENER
Datasheet:	ZICM3588SP2-2-R Datasheet (PDF)
	Large This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges

Price (USD)

1: USD 20.0869 ea
Line Total: USD 20.09

Availability - 0

MOQ: 1 Multiples: 1
Pack Size: 1

ZICM3588SP2-2-R More Buying Options & Price Grid(s)

Availability	Price	Buy Price	Quantity
0 Ship by Fri. 29 Nov to Thu. 05 Dec MOQ : 1 Multiples : 1	1 : USD 20.0869 10 : USD 18.9698 30 : USD 18.4995 50 : USD 18.186 100 : USD 17.9508 250 : USD 17.7156 500 : USD 17.2453

Specifications

Manufacturer California Eastern California Eastern
Product Category Unclassified Unclassified

We are delighted to provide the ZICM3588SP2-2-R from our California Eastern manufacturer, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the ZICM3588SP2-2-R and other electronic components in the California Eastern manufacturer and beyond.

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Additional Infomation About Product

MeshConnect EM35x Mini Modules ZICM35xSP0 and ZICM35xSP2 TM Ember EM35x Transceiver-Based Modules Integrated Transceiver Modules for ZigBee / Thread / IEEE 802.15.4 Development Kit Available: ZICM-EM35X-DEV-KIT-3 DESCRIPTION EM35x Mini Modules The MeshConnect EM35x Mini Modules from Powered by Ember ZigBee & Thread Solutions California Eastern Laboratories (CEL) combine high EM357 performance RF solutions with the market s premier KEY FEATURES: 12kB SRAM ZigBee and Thread stacks. Available in low and 32-bit ARM Cortex -M3 192kB Flash high output power options (+8dBm and +20dBm), Up to 23 GPIO Pins or these modules can accommodate variable range SPI (Master/Slave), EM358x and performance requirements. The tiny module TWI and UART Up to 64kB SRAM Up to 512kB Flash footprint makes them suitable for a wide range of Timers and Serial (Supports OTA) Wire/JTAG Interface ZigBee and Thread applications. The MeshConnect Optional USB 5-Channel 14-bit ADC Controller EM35x Mini Modules are certified and qualified, enabling customers to accelerate time to market by ZICM35xSP0 ZICM35xSP2 greatly reducing the design and certification phases Tx:+8dBm +20dBm of development. Rx: -100dBm -103dBm Link Budget: +108dB +123dB CELs MeshConnect EM35x Mini Modules ADDITIONAL FEATURES (ZICM35xSP0 and ZICM35xSP2) are based on the Data Rate: 250kbps Antenna Options: Ember EM35x (EM357 and EM358x) System on Chip 1) Integrated PCB Trace Antenna Advanced Power Management (SoC) radio ICs. Each IC is a complete single-chip 2) RF Port for External Antenna 16 RF Channels solution, compliant with ZigBee, Thread, and IEEE Supports Mesh Networks Industry s Premier Wireless 802.15.4. specifications. Networking Stacks: EmbeZNet AES Encryption PRO (ZigBee) and Silicon FCC, CE and IC Certifications Labs Thread CELs EM358x-based Mini Modules (ZICM358xSP0 RoHS Compliant Mini Footprint: - 0.940 x 0.655 and ZICM358xSP2) are ideal for customers requiring (23.9mm x 16.6mm) Over-the-Air (OTA) programming without an external Flash memory (such as Smart Energy or Home APPLICATIONS Automation), a larger memory footprint for complex Smart Energy/Grid Markets Commercial and Residential application control, or the additional resources to run - Thermostats Lighting - In-Home Displays - Fixtures and Control an IPv6-based networking stack like Thread. They - Smart Plugs Solar Inverters and Control also feature an optional on-board Universal Serial Home Automation and Control General ZigBee and Thread - Energy Management Bus (USB) 2.0 full-speed peripheral. Wireless Sensor Networking - Security Devices - HVAC Control Building Automation and Control This document is subject to change without notice Document No: 0011-00-07-01-000 (Issue H) Contributor Member Date Published: October 11, 2016 Page 1EM35x Mini Modules TABLE OF CONTENTS Introduction and Overview Description.............................................................................................................................................................................................. 1 Features................................................................................................................................................................................................... 1 Applications............................................................................................................................................................................................ 1 Ordering Information.............................................................................................................................................................................. 3 ZICM35xSPx Product Comparison Table.............................................................................................................................................. 4 Module Block Diagram........................................................................................................................................................................... 4 Development Tools.................................................................................................................................................................................. 5 System Level Function Transceiver IC.......................................................................................................................................................................................... 6 Antenna.................................................................................................................................................................................................... 6 Power Amplifier ....................................................................................................................................................................................... 6 USB........................................................................................................................................................................................................... 7 Software/Firmware................................................................................................................................................................................. 7 Electrical Specification Absolute Maximum Ratings................................................................................................................................................................... 8 Recommended Operating Condition..................................................................................................................................................... 8 DC Characteristics.................................................................................................................................................................................. 8 RF Characteristics.................................................................................................................................................................................. 9 Pin Signal and Interfaces Pin Signals I/O Configuration ............................................................................................................................................................... 10 I/O Pin Assignment................................................................................................................................................................................ 10 Module Dimensions................................................................................................................................................................................ 11 Module Land Footprint........................................................................................................................................................................... 12 13 Processing.......................................................................................................................................................................................... 15 Agency Certifications .................................................................................................................................................................... 16 Software Compliance.................................................................................................................................................................... 18 Shipment, Storage and Handling............................................................................................................................................. 18 Quality................................................................................................................................................................................................... 19 References.......................................................................................................................................................................................... 19 Revision History............................................................................................................................................................................... This document is subject to change without notice Page 2 Document No: 0011-00-07-01-000 (Issue H) Contributor Member

HS Compliance

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