R SURFBOARDS THE BREADBOARDING MEDIUM FOR SURFACE MOUNT TM IDS33518 33000 SERIES APPLICATION SPECIFIC ADAPTERS REV A- 10-2011 PARTIAL LISTING ACCEPTS ANALOG E-8-1 PKG MODEL 33518 FAIRCHILD 8LD,MICROPAK 1.6MM SQ. 8 LEAD .5 mm PITCH DEVICES ON SEMI ULLGA8 1.5x1.5,0.5P DEVICE LEAD WIDTH 1.5, To Max 3.0 MM UQFN8 1.5x1.5,0.5P UQFN8 1.6x1.6,0.5P TEXAS INST. RSE (S-PQFP-N8) UQFN RUG (S-PQFP-N8) ALWAYS CONSULT DEVICE DATA SHEET TO INSURE PROPER FIT Feature Pins on .1 in. Centers designed for use with Solderless breadboards, Conventional Breadboards, and Sockets with standard .1 in. centers. Use For Prototyping, Device Test or Evaluation and SMD to Through Hole Conversion. JUST ADD PARTS AND PLUG-IN TM DRAWINGS NOT TO FIG. MM IN. NOTE: SCALE SINGLE-IN-LINE ( SIP ) PINS A 20.32 .800 BOARD WIDTH +- .5mm .020in. ON .100 in. CENTERS EXAMPLE DEVICE ( J ) AND MAX WIDTH ( I ) B 10.16 .400 BOARD HEIGHT +-.5mm .020in. PAD SET 4 SIDED LEAD C 2.54 .100 SIP PIN SPACE +-.20mm .008in. FORMAT. D, D1 2.1 .083 PAD CENTERLINE PIN 1 LOCATION VARIABLE BASED E .5 .020 DEVICE LEAD PITCH ON DEVICE SELECTED. F 1.4 .055 PAD LENGTH SEE DEVICE G .3 .012 PAD WIDTH DATA SHEET. H .2 .008 GAP MOUNTING PADS ARE OVERSIZED IN LENGTH TO I 3.0 .118 MAX LEAD WIDTH ACCEPT A WIDER RANGE OF DEVICE WIDTHS AND J 1.5 .059 TYPICAL LEAD WIDTH TOLERANCES AND TO PERMIT HAND SOLDERING. SEE WEBSITE FOR SOLDERING SUGGESTIONS LENGTH FROM SHOULDER +-.5mm .020in. P 3.3 .130 BOARD SPECIFICATIONS S 1.57 .062 PIN SHOULDER HEGHT BOARD MATERIAL: .8mm, +-.13mm .031in+-..005 in. W .5 .020 PIN WIDTH Thick G-10 FR-4 Glass Epoxy or equivalent. RoHS CIRCUITS: 1 oz. Copper with RoHS compliant Lead Free Compliant TOLERANCES: If not noted are +- 20%. Nominal values are given. Controlling unit is Millimeters. EC 2002/95 solder coating. Patten Position on board +- .5mm .020in. Values rounded to nearest decimal. Slight Variations due to manufacturing process can occur. Copyright 2011 by Capital Advanced Technologies, Inc. All rights reserved. Surfboards is a registered trademark of Capital Advanced Technologies, Inc. The Breadboarding medium for surface mount, Just add parts and plug- in., and the Leaf Circuit Logo are trademarks of Capital Advanced Technologies, Inc. All other trademarks are the property of their respective owners. Specifications, availability, and price is subject to change without notice. All information given is believed to be accurate but is not guaranteed. The user of information given or products represented by such information is responsible for determining the suitability of said information or products for a given purpose. No inducement is intended or permission granted for infringement of any patent or unauthorized use of any intellectual property of Capital Advanced Technologies or others. CAPITAL ADVANCED TECHNOLOGIES, INC. MADE IN CAROL STREAM, ILLINOIS. USA PHONE 630-690-1696 FAX 630-690-2498 USA WWW.CapitalAdvanced.Com X-ON Electronics Largest Supplier of Electrical and Electronic Components Click to view similar products for capital advanced technologies manufacturer: Other Similar products are found below : 6010 US-2007 33208 33305 US-4007 US-5016 6306 US-5014 6816 33106 6520 33306 US-5012 US-3014 US-3008 US-2008 33110 US-3012 6405 US-3010 33008 US-1010 US-5008 33310 US-2012 US-4012 US-1009 33003 9163 9082 33708 US-1008 US-4010 US- 2006 33410 6115 US-1006 6112 33405 33105 US-1007 6908 6106 6109 6410 6008 33010 33308 6303 33205