DATASHEET MeshConnect EM357 Mini Modules ZICM357SP0, ZICM357SP2 TM Ember EM357 Transceiver Based Modules Integrated Transceiver Modules for ZigBee / IEEE 802.15.4 Development Kit available: ZICM-EM35X-DEV-KIT-2 DESCRIPTION MeshConnect EM357 Mini Modules The MeshConnect EM357 Mini Modules from 192 kB FLASH California Eastern Laboratories (CEL) combine high 12 kB SRAM performance RF solutions with the market s premier 32-bit ARM Cortex-M3 ZigBee stack. Available in low and high output Up to 23 GPIO Pins power options (+8dBm and +20dBm), these modules SPI (Master/Slave), TWI, UART Timers, Serial Wire/JTAG Interface can accommodate variable range and performance 5-channel 14-bit ADC requirements. The mini module footprint makes them suitable for a wide range of ZigBee applications. The ZICM357SP0 ZICM357SP2 MeshConnect EM357 Mini Modules are certified and Tx:+8dBm +20dBm Rx: -100dBm -103dBm qualified, enabling customers to accelerate time to Link Budget: +108dB +123dB market by greatly reducing the design and certification phases of development. FEATURES High RF Performance: Mini Footprint: CEL s MeshConnect EM357 Mini Modules Up to 123dB RF Link Budget - 0.940 x 0.655 RX Sensitivity: (ZICM357SP0 and ZICM357SP2) are based on the (23.9mm x 16.6mm) -100dBm (ZICM357SP0) Ember EM357 ZigBee compliant SoC radio IC. The Antenna Options -103dBm (ZICM357SP2) IC is a single-chip solution, compliant with ZigBee 1) Integrated PCB Trace Antenna Data Rate: 250kbps or specifications and IEEE 802.15.4, a complete Advanced Cortex-M3 Processor 2) RF Port for External Antenna wireless solution for all ZigBee applications. The Advanced Power Management Supports Mesh Networks IC consists of an RF transceiver with the baseband 16 RF Channels AES Encryption modem, a hardwired MAC and an embedded 32- Industry s Premier ZigBee Pro FCC, CE and IC Certifications bit ARM Cortex -M3 microcontroller with internal Stack: EmberZNet PRO ROHS Compliant RAM (12kB) and Flash (192kB) memory. The device provides numerous general-purpose I/O pins and APPLICATIONS Smart Energy/Grid Markets Building Automation peripheral functions such as timers and UARTs. - Thermostats and Control - In-Home Displays Commercial and Residential - Smart Plugs Lighting Home Automation and Control - Fixtures and Control - Energy Management Solar Inverters and Control - Security Devices General ZigBee Wireless - HVAC Control Sensor Networking This document is subject to change without notice Document No: 0011-00-07-00-000 (Issue H) Date Published: October 18, 2013 Page 1EM357 Mini Modules TABLE OF CONTENTS Introduction and Overview Description.............................................................................................................................................................................................. 1 Features.................................................................................................................................................................................................. 1 Applications............................................................................................................................................................................................ 1 Ordering Information............................................................................................................................................................................. 3 Module Block Diagram........................................................................................................................................................................... 3 Development Tools................................................................................................................................................................................. 3 System Level Function Transceiver IC......................................................................................................................................................................................... 4 Antenna................................................................................................................................................................................................... 4 Power Amplifier ...................................................................................................................................................................................... 4 Software/Firmware................................................................................................................................................................................. 5 Electrical Specification Absolute Maximum Ratings................................................................................................................................................................... 6 Recommended (Operating Condition).................................................................................................................................................. 6 DC Characteristics.................................................................................................................................................................................. 6 RF Characteristics.................................................................................................................................................................................. 6 Pin Signal and Interfaces Pin Signals I/O Configuration ................................................................................................................................................................ 7 I/O Pin Assignment................................................................................................................................................................................ 7 Module Dimensions................................................................................................................................................................................ 9 Module Land Footprint........................................................................................................................................................................... 10 11 Processing......................................................................................................................................................................................... 13 Agency Certifications ................................................................................................................................................................... 16 Shipment, Storage and Handling............................................................................................................................................. 16 Quality.................................................................................................................................................................................................. 17 References......................................................................................................................................................................................... 17 Revision History.............................................................................................................................................................................. This document is subject to change without notice Page 2 Document No: 0011-00-07-00-000 (Issue H)