ZICM3588SP0-1 CEL

PRELIMINARY DATASHEET MeshConnect EM35x Mini Modules ZICM35xSP0 and ZICM35xSP2 TM Ember EM35x Transceiver-Based Modules Integrated Transceiver Modules for ZigBee / IEEE 802.15.4 Development Kit Available: ZICM-EM35X-DEV-KIT-3 DESCRIPTION EM35x Mini Modules MeshConnect The MeshConnect EM35x Mini Modules from Powered by Ember ZigBee Solutions California Eastern Laboratories (CEL) combine high EM357 performance RF solutions with the market s premier KEY FEATURES: 12kB SRAM ZigBee stack. Available in low and high output 32-bit ARM Cortex -M3 192kB Flash power options (+8dBm and +20dBm), these modules Up to 23 GPIO Pins or can accommodate variable range and performance SPI (Master/Slave), EM358x requirements. The tiny module footprint makes them TWI and UART Up to 64kB SRAM Up to 512kB Flash suitable for a wide range of ZigBee applications. The Timers and Serial (Supports OTA) Wire/JTAG Interface MeshConnect EM35x Mini Modules are certified and Optional USB 5-Channel 14-bit ADC Controller qualified, enabling customers to accelerate time to market by greatly reducing the design and certification ZICM35xSP0 ZICM35xSP2 phases of development. Tx:+8dBm +20dBm Rx: -100dBm -103dBm Link Budget: +108dB +123dB CELs MeshConnect EM35x Mini Modules (ZICM35xSP0 and ZICM35xSP2) are based on ADDITIONAL FEATURES the Ember EM35x (EM357 and EM358x) ZigBee Data Rate: 250kbps Antenna Options: compliant System on Chip (SoC) radio ICs. Each IC is 1) Integrated PCB Trace Antenna Advanced Power Management a complete single-chip solution, compliant with ZigBee 2) RF Port for External Antenna 16 RF Channels specifications and IEEE 802.15.4. Supports Mesh Networks Industry s Premier ZigBee PRO Stack: EmberZNet PRO AES Encryption Mini Footprint: CELs EM358x-based Mini Modules (ZICM358xSP0 FCC, CE and IC Certifications - 0.940 x 0.655 and ZICM358xSP2) are ideal for customers requiring RoHS Compliant (23.9mm x 16.6mm) Over-the-Air (OTA) programming (such as Smart Energy or Home Automation) or a larger memory APPLICATIONS Smart Energy/Grid Markets footprint for complex application control. They also Building Automation - Thermostats and Control feature an optional on-board Universal Serial Bus - In-Home Displays Commercial and Residential (USB) 2.0 full-speed peripheral. - Smart Plugs Lighting Home Automation and Control - Fixtures and Control - Energy Management Solar Inverters and Control - Security Devices General ZigBee Wireless - HVAC Control Sensor Networking This document is subject to change without notice Document No: 0011-00-07-01-000 (Issue E) Date Published: March 18, 2014 Page 1EM35x Mini Modules TABLE OF CONTENTS Introduction and Overview Description.............................................................................................................................................................................................. 1 Features.................................................................................................................................................................................................. 1 Applications............................................................................................................................................................................................ 1 Ordering Information............................................................................................................................................................................. 3 ZICM35xSPx Product Comparison Table.............................................................................................................................................. 3 Module Block Diagram........................................................................................................................................................................... 4 Development Tools................................................................................................................................................................................. 5 System Level Function Transceiver IC......................................................................................................................................................................................... 6 Antenna................................................................................................................................................................................................... 6 Power Amplifier ...................................................................................................................................................................................... 6 USB.......................................................................................................................................................................................................... 7 Software/Firmware................................................................................................................................................................................. 7 Electrical Specification 8 Absolute Maximum Ratings................................................................................................................................................................... Recommended Operating Condition..................................................................................................................................................... 8 DC Characteristics.................................................................................................................................................................................. 8 RF Characteristics.................................................................................................................................................................................. 9 Pin Signal and Interfaces Pin Signals I/O Configuration ................................................................................................................................................................ 10 I/O Pin Assignment................................................................................................................................................................................ 10 Module Dimensions................................................................................................................................................................................ 11 Module Land Footprint........................................................................................................................................................................... 12 13 Processing......................................................................................................................................................................................... 15 Agency Certifications ................................................................................................................................................................... 17 Software Compliance.................................................................................................................................................................... 18 Shipment, Storage and Handling............................................................................................................................................. 18 Quality.................................................................................................................................................................................................. 19 References......................................................................................................................................................................................... 19 Revision History.............................................................................................................................................................................. This document is subject to change without notice Page 2 Document No: 0011-00-07-01-000 (Issue E)