MULTILAYER CERAMIC CHIP CAPACITORS RoHS Compliant / (High Reliability) FEATURES 1. Small size and large capacitance, high ripple current. 2. Temperature characteristic is Y5U in EIA code. 3. Superior humidity characteristic and long life. 4. Excellent noise absorption. APPLICATIONS 1. Smoothing circuit of small size DC-DC converter. 2. On-board power supply. 3. Noise suppressor for various kinds of equipments. 4. By-pass or decoupling circuits. CONSTRUCTION Ceramic Dielectric Termination Tin Plating (21, 31, 32, 43size : For flow or reflow soldering) (55, 76size : For reflow soldering only) Silver (THC Series only) (All sizes : For reflow soldering only) Internal Electrode RATINGS Category Temperature Range 1. -55 to +125C 2. Rated Voltage Range 25, 50, 100, 200Vdc 3. Rated Capacitance Range 0.047 to 47MF 80 Rated Capacitance Tolerance 4. M (P20%) , Z (P %) 20 5. Temperature Characteristics E (JIS) Y5U (EIA) 6. Rated Ripple Current See No.5 on the following table SPECIFICATIONS No. Items Specification Test Condition 1 Withstand Voltage No abnormality. 250% of rated voltage shall be applied for 5 seconds. 2 Insulation Resistance 1000/CR(MO) or 10000(MO) Rated voltage shall be applied for 60P5 seconds at whichever is less. temperature 20P2C. 3 Rated Capacitance Within specified tolerance. Temperature : 20P2C Frequency : 1P0.1kHz Voltage : 1P0.2Vrms 4 Dissipation Factor 5.0% maximum. Temperature : 20P2C Frequency : 1P0.1kHz Voltage : 1P0.2Vrms 10kHzK1MHz (sine curve) 5 Rated Ripple Current Size code 21 31 32 43 55 76 Ripple voltage Vp shall be less than Arms 0.2 0.3 0.5 1.0 2.0 3.0 the rated voltage. (1/4) CAT. No. E1002PMULTILAYER CERAMIC CHIP CAPACITORS / SPECIFICATIONS No. Items Specification Test Condition 6 Adhesion No visible damage. Substrate 5N (0.51kgf) for 10P1 seconds Capacitor 7 Bend strength of the face plating Appearance : No visible damage. The substrate shall be bend by 1mm at a rate of 1mm/s DC/C : P15% for 5 seconds. Press bar Press Capacitor Substrate 1.0mm 45P2mm 45P2mm Support 8 Solderability Min. 75% of surface of the termination Solder Pb Free Eutectic shall be covered with new solder Solder Temperature 245P5C 235P5C Dipping Time 2P0.5sec. 9 Resistance to Soldering Heat Appearance : No visible damage. Solder Temperature : 260P5C DC/C : P15% Dipping Time : 2P0.5 seconds D.F. : To meet the initial specification. I.R. : To meet the initial specification. 10 Temperature Cycle Appearance : No visible damage. Step Temperature (C) (min.) DC/C : P15% 1 Min. Category temperature P3 30P3 D.F. : To meet the initial specification. 2 Room temperature 3 max. I.R. : To meet the initial specification. 3 Max. Category temperature P3 30P3 4 Room temperature 3 max. <Cycle> THC series : 5 cycles TMC series : 100 cycles 11 Humidity Load Life Appearance : No abnormality. Temperature : 40P2C DC/C : P20% Humidity : 90 to 95%RH D.F. : 7% maximum Voltage : Rated voltage 24 I.R. : 50/CR(MO) or 1000(MO) Time : 500P hours 0 whichever is less. Temperature : 85P2C 12 Endurance Appearance : No abnormality. Voltage : 200% of rated voltage. DC/C : P20% 48 Time : 1000P hours D.F. : 7% maximum 0 I.R. : 100/CR(MO) or 1000(MO) Temperature : 125P3C whichever is less. Voltage : Rated voltage 48 Time : 1000P hours 0 *CR : Rated Capacitance(MF) (2/4) CAT. No. E1002P