KTF500B225M32NHT00 Chemi-Con

MULTILAYER CERAMIC CHIP CAPACITORS Up grade Up grade RoHS Compliant / Temperature cycle : 1000 cycles FEATURES 1. Large capacitance by small size. 2. Excellent noise absorption. 3. High permissible ripple current capability. 4. NTF: Temperature cycle : 1,000 cycles. APPLICATIONS 1. Smoothing circuit of DC-DC converters. 2. On-board power supplies. 3. Voltage regulators for computers. 3. Noise suppressor for various kinds of equipments. 4. High reliability equipments. CONSTRUCTION Ceramic Dielectric Termination (Tin Plating) Internal Electrode RATINGS 1. Category Temperature Range -55 to +125C 2. Rated Voltage Range 25, 50, 100, 250Vdc 3. Rated Capacitance Range 0.033 to 33MF 4. Rated Capacitance Tolerance K (P10%) , M (P20%) 5. Temperature Characteristics X7R 6. Rated Ripple Current See No.5 on the following table SPECIFICATIONS No. Items Specification Test Condition 1 Withstand Voltage No abnormality. 250% of rated voltage shall be applied for 5 seconds. (Only 250Vdc product : 475V) 2 Insulation Resistance 100/CR(MO) or 4000(MO) Rated voltage shall be applied for 60P5 seconds at temperature 25P2C. whichever is less. 3 Rated Capacitance Within specified tolerance. CR 10MFCR>10MF Temperature 25P2C 4 Dissipation Factor 5.0% maximum. Frequency 1P0.1kHz 120P12Hz Voltage 1P0.2Vrms 0.5P0.2Vrms 10kHzK1MHz (sine curve) 5 Rated Ripple Current Size code 31 32 43 55 Ripple voltage Vp shall be less than Arms 0.3 0.5 1.0 2.0 the rated voltage. (1/4) CAT. No. E1002PMULTILAYER CERAMIC CHIP CAPACITORS Up grade Up grade / SPECIFICATIONS No. Items Specification Test Condition 6 Adhesion No visible damage. Substrate 5N (0.51kgf) for 10P1 seconds Capacitor 7 Bend strength of the face plating Appearance : No visible damage. The substrate shall be bend at a rate of 1mm/s DC/C : P15% for 5 seconds. Press bar Press Capacitor Substrate Bending capability* 45P2mm 45P2mm Support *Bending capability NTS : 1mm NTF : 1mm or 2mm 8 Solderability Min. 75% of surface of the termination Solder Pb Free Eutectic shall be covered with new solder Solder Temperature 245P5C 235P5C Dipping Time 2P0.5sec. 9 Resistance to Soldering Heat Appearance : No visible damage. Solder Temperature : 260P5C DC/C : P15% Dipping Time : 2P0.5 seconds D.F. : To meet the initial specification. I.R. : To meet the initial specification. 10 Temperature Cycle Appearance : No visible damage. Step Temperature (C) (min.) DC/C : P15% 1 Min. Category temperature P3 30P3 D.F. : To meet the initial specification. 2 Room temperature 3 max. I.R. : To meet the initial specification. 3 Max. Category temperature P3 30P3 4 Room temperature 3 max. For above temperature cycle. NTS : For 5 cycles NTF : For 1000 cycles 11 Humidity Load Life Appearance : No abnormality. Temperature : 40P2C DC/C : P15% Humidity : 90 to 95%RH D.F. : 10% maximum Voltage : Rated voltage 24 I.R. : 25/CR(MO) or 1000(MO) Time : 500P hours 0 whichever is less. 12 Endurance Appearance : No abnormality. Temperature : 125P3C DC/C : P15% Voltage : Rated voltage 48 D.F. : 10% maximum Time : 1000P hours 0 I.R. : 50/CR(MO) or 1000(MO) whichever is less. *CR : Rated Capacitance(MF) (2/4) CAT. No. E1002P