X-On Electronics has gained recognition as a prominent supplier of TS391SNL10 Solder across the USA, India, Europe, Australia, and various other global locations. TS391SNL10 Solder are a product manufactured by Chip Quik. We provide cost-effective solutions for Solder, ensuring timely deliveries around the world.

TS391SNL10 Chip Quik

TS391SNL10 electronic component of Chip Quik
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See Product Specifications
Part No.TS391SNL10
Manufacturer: Chip Quik
Category: Solder
Description: Solder Paste NoClean 35g T4 Sn96.5/Ag3.0/Cu0.5
Datasheet: TS391SNL10 Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1: USD 33.7606 ea
Line Total: USD 33.76 
Availability - 103
Ship by Fri. 27 Dec to Tue. 31 Dec
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
103
Ship by Fri. 27 Dec to Tue. 31 Dec
MOQ : 1
Multiples : 1
1 : USD 33.7606

   
Manufacturer
Product Category
Product
Type
Alloy
Description/Function
Package Type
Contains Lead
Hts Code
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We are delighted to provide the TS391SNL10 from our Solder category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the TS391SNL10 and other electronic components in the Solder category and beyond.

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TS391SNL10 TS391SNL10 Datasheet revision 1.1 www.chipquik.com Thermally Stable Solder Paste No-Clean Sn96.5/Ag3.0/Cu0.5 T4 (35g Syringe) Product Highlights Revolutionary Formula: No Refrigeration Required Low voiding Printing speeds up to 125mm/sec Excellent wetting compatibility on most board finishes Long stencil life Dispense grade Wide process window Compatible with enclosed print heads Clear residue RoHS II and REACH compliant Specifications Alloy: Sn96.5/Ag3.0/Cu0.5 Mesh Size: T4 Micron (m) Range: 20-38 Flux Type: Synthetic No-Clean Flux Classification: ROL0 Metal Load: 87% Metal by Weight Melting Point: 217-220C (423-428F) Packaging: 10cc/35g Syringe Shelf Life: Refrigerated >12 months, Unrefrigerated >12 months *See notes below: *Shelf Life Notes: Chip Quik solder paste is good past its quoted shelf life, regardless of refrigeration. Before use, visually inspect the solder paste to ensure it is not dried out or clumpy, or check stencil release. If stored in a jar, stir the product thoroughly for 2-3 minutes before inspection and use. Chip Quik solder paste is manufactured using Made in USA high quality synthetic flux and precision atomized metal powder. Chip Quik solder paste is guaranteed for 12 months from date of manufacture, regardless of refrigeration. If you have any issues with our solder paste, please contact Chip Quik directly for no charge warranty replacement. Please retain original bill of sale, and solder paste in original container as we may request its return for internal R&D testing purposes. Printer Operation Print Speed: 25-125mm/sec Squeegee Pressure: 70-250g/cm of blade Under Stencil Wipe: Once every 10-25 prints, or as necessary Stencil Life >12 hours 20-50% RH 22-28C (72-82F) >4 hours 50-70% RH 22-28C (72-82F) Stencil Cleaning Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using isopropyl alcohol (IPA). Storage and Handling Store at room temperature 20-25C (68-77F). Do not freeze. Chip Quik Thermally Stable solder paste should be stored at its operating temperature (room temperature) of 20-25C (68-77F), therefore no warming time is required before use. Transportation This product has no shipping restrictions. Shipping below 0C (32F) or above 25C (77F) for normal transit times by ground or air will not impact this products stated shelf life. 1 1994-2019 Chip Quik Inc. Recommended Profile Reflow profile for Sn96.5/Ag3.0/Cu0.5 solder assembly, designed as a starting point for process optimization. 249C (480F) 217C (423F) 175C (347F) Temperature 150C (302F) 25C (77F) 0sec 90sec 180sec 210sec 240sec 270sec Time Test Results Test J-STD-004 or other Test Requirement Result requirements as stated Copper Mirror IPC-TM-650: 2.3.32 L: No breakthrough Corrosion IPC-TM-650: 2.6.15 L: No corrosion Quantitative Halides IPC-TM-650: 2.3.28.1 L: <0.05% Electrochemical Migration IPC-TM-650: 2.6.14.1 L: <1 decade drop (No-clean) Surface Insulation Resistance 85C, IPC-TM-650: 2.6.3.7 L: 100M (No-clean) 85% RH 168 Hours Tack Value IPC-TM-650: 2.4.44 33g Viscosity Malcom 10 RPM/25C IPC-TM-650: 2.4.34.4 Print: 140-195, Dispense: 115-160 3 (x10 mPa/s) Visual IPC-TM-650: 3.4.2.5 Clear and free from precipitation Conflict Minerals Compliance Electronic Industry Citizenship Compliant Coalition (EICC) REACH Compliance Articles 33 and 67 of Regulation (EC) Contains no substance >0.1% w/w that No 1907/2006 is listed as a SVHC or restricted for use in solder materials Conforms to the following Industry Standards: J-STD-004B, Amendment 1 (Solder Fluxes): Yes J-STD-005A (Solder Pastes): Yes J-STD-006C, Amendments 1 & 2 (Solder Alloys and Fluxed/Non-Fluxed Solders): Yes RoHS 2 Directive 2011/65/EU: Yes 2 1994-2019 Chip Quik Inc.

Tariff Desc

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