TS391SNL250 TS391SNL250 Datasheet revision 1.1 www.chipquik.com Thermally Stable Solder Paste No-Clean Sn96.5/Ag3.0/Cu0.5 T4 (250g Jar) Product Highlights Revolutionary Formula: No Refrigeration Required Low voiding Printing speeds up to 125mm/sec Excellent wetting compatibility on most board finishes Long stencil life Print grade Wide process window Compatible with enclosed print heads Clear residue RoHS II and REACH compliant Specifications Alloy: Sn96.5/Ag3.0/Cu0.5 Mesh Size: T4 Micron (m) Range: 20-38 Flux Type: Synthetic No-Clean Flux Classification: ROL0 Metal Load: 88.5% Metal by Weight Melting Point: 217-220C (423-428F) Packaging: 250g Jar Shelf Life: Refrigerated >12 months, Unrefrigerated >12 months *See notes below: *Shelf Life Notes: Chip Quik solder paste is good past its quoted shelf life, regardless of refrigeration. Before use, visually inspect the solder paste to ensure it is not dried out or clumpy, or check stencil release. If stored in a jar, stir the product thoroughly for 2-3 minutes before inspection and use. Chip Quik solder paste is manufactured using Made in USA high quality synthetic flux and precision atomized metal powder. Chip Quik solder paste is guaranteed for 12 months from date of manufacture, regardless of refrigeration. If you have any issues with our solder paste, please contact Chip Quik directly for no charge warranty replacement. Please retain original bill of sale, and solder paste in original container as we may request its return for internal R&D testing purposes. Printer Operation Print Speed: 25-125mm/sec Squeegee Pressure: 70-250g/cm of blade Under Stencil Wipe: Once every 10-25 prints, or as necessary Stencil Life >12 hours 20-50% RH 22-28C (72-82F) >4 hours 50-70% RH 22-28C (72-82F) Stencil Cleaning Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using isopropyl alcohol (IPA). Storage and Handling Store at room temperature 20-25C (68-77F). Do not freeze. Chip Quik Thermally Stable solder paste should be stored at its operating temperature (room temperature) of 20-25C (68-77F), therefore no warming time is required before use. Transportation This product has no shipping restrictions. Shipping below 0C (32F) or above 25C (77F) for normal transit times by ground or air will not impact this products stated shelf life. 1 1994-2019 Chip Quik Inc. Recommended Profile Reflow profile for Sn96.5/Ag3.0/Cu0.5 solder assembly, designed as a starting point for process optimization. 249C (480F) 217C (423F) 175C (347F) Temperature 150C (302F) 25C (77F) 0sec 90sec 180sec 210sec 240sec 270sec Time Test Results Test J-STD-004 or other Test Requirement Result requirements as stated Copper Mirror IPC-TM-650: 2.3.32 L: No breakthrough Corrosion IPC-TM-650: 2.6.15 L: No corrosion Quantitative Halides IPC-TM-650: 2.3.28.1 L: <0.05% Electrochemical Migration IPC-TM-650: 2.6.14.1 L: <1 decade drop (No-clean) Surface Insulation Resistance 85C, IPC-TM-650: 2.6.3.7 L: 100M (No-clean) 85% RH 168 Hours Tack Value IPC-TM-650: 2.4.44 33g Viscosity Malcom 10 RPM/25C IPC-TM-650: 2.4.34.4 Print: 140-195, Dispense: 115-160 3 (x10 mPa/s) Visual IPC-TM-650: 3.4.2.5 Clear and free from precipitation Conflict Minerals Compliance Electronic Industry Citizenship Compliant Coalition (EICC) REACH Compliance Articles 33 and 67 of Regulation (EC) Contains no substance >0.1% w/w that No 1907/2006 is listed as a SVHC or restricted for use in solder materials Conforms to the following Industry Standards: J-STD-004B, Amendment 1 (Solder Fluxes): Yes J-STD-005A (Solder Pastes): Yes J-STD-006C, Amendments 1 & 2 (Solder Alloys and Fluxed/Non-Fluxed Solders): Yes RoHS 2 Directive 2011/65/EU: Yes 2 1994-2019 Chip Quik Inc.