X-On Electronics has gained recognition as a prominent supplier of conga-MA5/CSP-B Heat Sinks across the USA, India, Europe, Australia, and various other global locations. conga-MA5/CSP-B Heat Sinks are a product manufactured by Congatec. We provide cost-effective solutions for Heat Sinks, ensuring timely deliveries around the world.

conga-MA5/CSP-B Congatec

conga-MA5/CSP-B electronic component of Congatec
conga-MA5/CSP-B Congatec
conga-MA5/CSP-B Heat Sinks
conga-MA5/CSP-B  Thermal Management

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Part No. conga-MA5/CSP-B
Manufacturer: Congatec
Category: Heat Sinks
Description: Heat Sinks Passive cooling solution for COM Express Mini Type10 module conga-MA5 with open silicon Intel Pentium and Celeron processor. All standoffs are with 2.7mm bore hole.
Datasheet: conga-MA5/CSP-B Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1: USD 34.5345 ea
Line Total: USD 34.53 
Availability - 0
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
0
Ship by Thu. 06 Mar to Mon. 10 Mar
MOQ : 1
Multiples : 1
1 : USD 34.5345
5 : USD 33.033
10 : USD 32.5248
25 : USD 31.7625
500 : USD 31.7509

   
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We are delighted to provide the conga-MA5/CSP-B from our Heat Sinks category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the conga-MA5/CSP-B and other electronic components in the Heat Sinks category and beyond.

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POWERFUL AND SMALL conga-MA5 th - 5 Gen. Intel Atom processor family - COM Express Mini Type 10 module - Intel 9th generation (Gen 9) LP graphics - Up to 4k resolution (4096x2160 60Hz) - 4K Codec Decode & Encode for HEVC, H.264, VP8 Formfactor Formfactor COM Express Mini (55 x 84 mm) Type 10 CPU Intel Pentium N4200 2.50 GHz (Burst) 1.1 GHz Clock Quad Core L2 cache 2MB 6W TDP Intel Celeron N3350 2.40 GHz (Burst) 1.1 GHz Clock Dual Core L2 cache 2MB 6W TDP Intel Atom x7-E3950 2.00 GHz (Burst) 1.6 GHz Clock Quad Core L2 cache 2MB 12W TDP Intel Atom x5-E3940 1.80 GHz (Burst) 1.6 GHz Clock Quad Core L2 cache 2MB 9.5W TDP Intel Atom x5-E3930 1.80 GHz (Burst) 1.3 GHz Clock Dual Core L2 cache 2MB 6.5W TDP DRAM Dual channel onboard DDR3L memory support for up to 8 GByte at 1866MT/s Chipset Integrated in SoC Ethernet Intel I210 (Industrial) / I211 (Commercial) Gigabit Ethernet Controller I/O Interfaces 4x PCIe Gen2 2x USB 3.0/2.0 6x USB 2.0 2x SATA3 SDIO LPC Bus SMBus I2C Bus 2x UART Onboard storage eMMC 5.0 interface up to 128GB Sound Intel High Definition Audio (Intel HD Audio) Graphics Intel HD Graphics 500 with support for 4k Ultra HD displays DirectX 12 OpenGL 4.4 OpenCL 2.0 OpenGL ES 3.0 HDCP 1.4 (wired), HDCP 2.0 (wireless) Video decode hardware acceleration including support for 4kp60 HEVC (H.265), H.264, MVC, VP8, VP9, VC-1, WMV9, JPEG/MJPEG Video encode hardware acceleration including support for 4kp30 HEVC (H.265), H.264, MVC, VP8, JPEG/MJPEG. LVDS 18/24-bit Single Channel LVDS Interface, resolutions up to 1280X1024 60Hz VESA standard or JEIDA data mapping Automatic Panel Detection via EDID/EPI shared with eDP 1.3 supporting up to 3840x2160 60 Hz (option) Digital Display Interface DisplayPort 1.2 up to 40962160 60Hz or DDI up to 38402160 60Hz congatec Board Controller Multistage watchdog non-volatile user data storage manufacturing and board Information board statistics IC bus (fast mode 400 kHz multi master) power loss control Embedded BIOS Features AMI Aptio UEFI 2.x firmware 8 MByte serial SPI with congatec Embedded BIOS features OEM Logo OEM CMOS Defaults LCD Control Display Auto Detection Backlight Control Flash Update TPM Infineons Trusted Platform Module (TPM 2.0/1.2) SLB 9665/9660 option Power Management ACPI 5 .0 compliant Smart Battery Management Operating Systems Microsoft Windows 10 Microsoft Windows 10 IoT Enterprise Microsoft Windows 10 IoT Core Linux Yocto Android Power Consumption Typ. application 6W...12W Temperature Commercial : Operating: 0 to +60C Storage: -20 to +70C Industrial: Operating: -40 to +85C Storage: -40 to +85C Humidity Operating: 10 to 90% r. H. non cond. Storage: 5 to 95% r. H. non cond. Size 55 x 84 mm (2.17 x 3.31) www.congatec.comconga-MA5 Block diagram COM Express 2.1 Type 10 Intel Apollo Lake A-B Connector LVDS/eDP Assembly Option COMPUTE UNIT 0R0 eDP PROCESSOR CORE LVDS A / eDP Tri-gate 3-D 14nm Quad core SoC eDP LVDS 1MB L2 cache shared by 2 cores DDR3L 1866 Core 1 Core 2 DDI0 Core 3 Core 4 DDR3L DDI 1866 AES SSE4.2 PCIe0 PCIe Port 0 PCIe1 PCIe Port 1 UNCORE UNIT PCIe2 PCIe Port 2 1 Support max. 4 links (inc. for Lan)* PCIe3 PCIe Port 3 DISPLAY & GRAPHICS MEDIA Intel Gen9 LP OpenGL 4.3 DirectX 12.0 GBE PCIe4 PCIe-GBE Ethernet OpenCL 2.0 MIPI OpenGL ES 3.0 Intel i210 / i211 CSI x4 Multimedia Features HEVC VP8 MPEG2 WMV9 MIPI 2x SATA 6Gb/s CSI x2 SATA Port 1-0 VC-1 H.264 VP9 M/JPEG Interfaces 2x USB SS DisplayPort DDI eDP USB SS Ext. 1-0 8x USB 2.0 USB 2.0 Port 7-0 HDA INTEGRATED I/O HDA I/F Integrated I/O Interfaces eMMC FSPI SPI Bus HS400 SATA USB 3.0/2.0 SPI BIOS PCIe LPC Bus GPIOs SDv3 SD / GPIO MUX HD Audio emmC/SD UART UARTs LS UART Port 1-0 SIO Assembly Option SIO LPC LPC Bus TPM GPIO Notes: SM Bus 1 * : PCIe 3 is available only for cong x4 or no GbE congatec I2C Bus Board Controller PWR control FAN control www.congatec.com SSD MIPI-CSI2 on-module DDR3L 2 / 4 / 8GB

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7612.90.00 -Other Aluminium structures (excluding prefabricated buildings of heading no. 94.06) and parts of structures (for example, bridges and bridge-sections, towers, lattice masts, roofs, roofing frameworks, doors and windows and their frames and thresholds for doors, balustrades, pillars and columns); aluminium plates, rods, profiles, tubes and the like, prepared for use in structures:
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