CLD-DS102 Rev 2O
Product family data sheet
Cree XLamp MHB-A LEDs
Pro DuCt DEsCriPtion FEAturEs tABLE o F ContEnts
The XLamp MHB-A LeD is a new Flexible 9-v, 18-v or 36-v options Characteristics ...........................................2
generation of high-power LeD that Maximum drive current: 700mA (9V), Flux Characteristics, easyWhite Order
delivers a more effective way to achieve 350mA (18V), 175mA (36V) Codes and Bins - 9V ..................................3
low-cost systems than mid-power (MP) viewing angle: 115 Flux Characteristics, easyWhite Order
LeDs. Built using Crees high-reliability Available in 70-CRI, 80-CRI and 90-CRI Codes and Bins - 18V ................................6
ceramic-package technology, the XLamp options Flux Characteristics, easyWhite Order
MHB-A LeD is able to operate at higher Unlimited floor life at 30C/85%RH Codes and Bins - 36V ................................9
temperatures than MP LeDs with no Reflow solderable - JEDEC Relative Spectral Power Distribution ......12
reduction in rated lifetime, enabling an J-STD-020C Relative Flux vs. Junction Temperature ..12
impressive 60% reduction in heat sink electrically neutral thermal path electrical Characteristics .........................13
size and cost. Using up to 26 times RoHS and ReACh compliant Relative Flux vs. Current ..........................14
fewer LeDs than MP LeDs to achieve UL recognized component (e349212) Relative Chromaticity vs. Current ............16
the same performance, the XLamp Relative Chromaticity vs. Temperature ...17
MHB-A LeD is optimized to simplify Typical Spatial Distribution ......................17
LeD system designs for directional and Thermal Design ........................................18
semi-directional applications. Performance Groups Luminous Flux...19
Performance Groups Chromaticity ......20
Crees Standard White Chromaticity
Regions Plotted on the 1931 CIe Curve ..21
Bin and Order Code Formats ...................22
Reflow Soldering Characteristics ............23
Notes ........................................................24
Mechanical Dimensions ..........................26
Tape and Reel ...........................................27
Packaging .................................................28
Copyright 2014-2017 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree , XLamp and Cree, Inc.
EasyWhite are registered trademarks and the Cree logo is a trademark of Cree, Inc. UL and the UR logo are registered trademarks of UL LLC. 4600 Silicon Drive
Durham, NC 27703
USA Tel: +1.919.313.5300
WWW.CREE.Com/XLAmp
XLamp mHB- a LED
CHArAC tEristiCs
Characteristics unit Minimum t ypical Maximum
Thermal resistance, junction to solder point C/W 5.5
viewing angle (FWHM) degrees 115
Temperature coefficient of voltage (9V) mV/C -4
Temperature coefficient of voltage (18V) mV/C -8
Temperature coefficient of voltage (36V) mV/C -16
eSD withstand voltage (HBM per Mil-Std-883D) v 8000
DC forward current (9V) mA 480 700
DC forward current (18V) mA 240 350
DC forward current (36V) mA 120 175
Reverse current (9V, 18V, 36V) mA 0.1
Forward voltage (9V, @ 480mA, 85C) v 9.25
Forward voltage (9V, @ 480mA, 25C) v 10.5
Forward voltage (18V, @ 240mA, 85C) v 18.5
Forward voltage (18V, @ 240mA, 25C) v 21
Forward voltage (36V, @ 120mA, 85C) v 37
Forward voltage (36V, @ 120mA, 25C) v 42
LeD junction temperature C 150
Copyright 2014-2017 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree , XLamp and EasyWhite are registered trademarks and the Cree logo is a
trademark of Cree, Inc. UL and the UR logo are registered trademarks of UL LLC.
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