CLD-DS146 Rev 1 e Product family data sheet Cree XLamp MHB-B LEDs Pro DuCt DEsCriPtion FEAturEs tABLE o F ContEnts The XLamp MHB-B LeD is a new high- Flexible 9-v, 18-v or 36-v options Characteristics ...........................................2 power LeD that enables a more effective Maximum drive current: 700mA (9V), Flux Characteristics, easyWhite Order way to lower system costs for high 350mA (18V), 175mA (36V) Codes and Bins - 9V ..................................3 lumen lighting applications, such as viewing angle: 115 Flux Characteristics, easyWhite Order high-bay, roadway and outdoor area, than Available in 70-CRI, 80-CRI and 90-CRI Codes and Bins - 18V ................................5 mid-power LeDs. options Flux Characteristics, easyWhite Order Unlimited floor life at 30C/85%RH Codes and Bins - 36V ................................7 Leveraging key elements of Crees SC5 Reflow solderable - JEDEC Relative Spectral Power Distribution ........9 Technology Platform, the ceramic J-STD-020C Relative Flux vs. Junction Temperature ....9 MHB-B LeDs combine high light output, electrically neutral thermal path electrical Characteristics .........................10 high efficacy and high reliability to enable RoHS and ReACh compliant Relative Flux vs. Current ..........................11 high lumen LeD designs that are not UL recognized component (E349212) Relative Chromaticity vs. Current ............13 possible with mid-power LeDs. Relative Chromaticity vs. Temperature ...14 Typical Spatial Distribution ......................14 The MHB-B LeD delivers higher LPW than Thermal Design ........................................15 the MHB-A LeD in the same 5mm x 5mm Performance Groups Luminous Flux ..16 package, allowing lighting manufacturers Thermal Design - Continued ....................16 to quickly increase performance for Performance Groups Chromaticity ......17 existing MHB designs without any Crees Standard White Chromaticity additional investment. Regions Plotted on the 1931 CIe Curve ..18 Bin and Order Code Formats ...................19 Reflow Soldering Characteristics ............20 Notes ........................................................21 Mechanical Dimensions ..........................23 Tape and Reel ...........................................24 Packaging .................................................25 Copyright 2016-2017 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree , XLamp and Cree, Inc. EasyWhite are registered trademarks and SC5 Technology and the Cree logo are trademarks of Cree, Inc. UL and the UR logo are registered 4600 Silicon Drive trademarks of UL LLC. Durham, NC 27703 USA Tel: +1.919.313.5300 WWW.CREE.Com/XLAmp XLamp mHB-B LED CHArAC tEristiCs Characteristics unit Minimum t ypical Maximum Thermal resistance, junction to solder point C/W 4.0 Viewing angle (FWHM) degrees 115 Temperature coefficient of voltage (9V) mV/C -4 Temperature coefficient of voltage (18V) mV/C -8 Temperature coefficient of voltage (36V) mV/C -16 ESD withstand voltage (HBM per Mil-Std-883D) v 8000 DC forward current (9V) mA 700 DC forward current (18V) mA 350 DC forward current (36V) mA 175 Reverse current mA 0.1 Forward voltage (9V, 480mA, 85C) v 8.75 Forward voltage (9V, 480mA, 25C) v 10 Forward voltage (18V, 240mA, 85C) v 17.5 Forward voltage (18V, 240mA, 25C) v 20 Forward voltage (36V, 120mA, 85C) v 35 Forward voltage (36V, 120mA, 25C) v 40 LeD junction temperature C 150 Copyright 2016-2017 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree , XLamp and EasyWhite are registered trademarks and SC5 Technology and the Cree logo are trademarks of Cree, Inc. UL and the UR logo are registered trademarks of UL LLC. 2