CLD-DS90 Rev 1H Product family data sheet Cree XLamp XB-H LEDs Pro DuCt DEsCriPtion FEAturEs tABLE o F ContEnts The XLamp XB-H LeD delivers a Available in white, outdoor white Characteristics ........................................2 breakthrough combination of lumen and 80, 85 and 90CRI white Flux Characteristics ................................3 output and efficacy in a small package. ANSIcompatible chromaticity bins Relative Spectral Power Distribution .....4 Delivering more than 500 lumens at Binned at 85C Relative Flux vs. Junction 2 1.5A, 25C in a 2.45mm package, the Maximum drive current: 1500mA Temperature ...........................................4 Cree XB-H LeD offers triple the lumen Low thermal resistance: 4C/W electrical Characteristics ........................5 density of competing highpower LEDs Wide viewing angle: 110 Relative Flux vs. Current .........................5 to significantly increase the performance Unlimited floor life at Relative Chromaticity vs Current and of todays lighting designs. The XBH LED 30C/85% RH Temperature ............................................6 joins a new generation of directionally Reflow solderable JEDEC Typical Spatial Distribution .....................7 optimized LEDs that offers the industrys JSTD020C Thermal Design .......................................7 highest optical control factor (OCF), Electrically neutral thermal path Reflow Soldering Characteristics ...........8 a measurement of how LED size and RoHS and REACh compliant Notes .......................................................9 performance benefit directional lighting UL recognized component Mechanical Dimensions .......................11 applications. HighOCF LEDs enable (E349212) Tape and Reel ........................................12 lighting manufacturers to improve the Packaging ..............................................13 performance of any lighting design, create smaller and less expensive systems, and develop new lighting solutions that were previously not possible. Copyright 2014-2017 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree and XLamp are Cree, Inc. registered trademarks and the Cree logo is a trademark of Cree, Inc. UL and the UR logo are registered trademarks of UL LLC. 4600 Silicon Drive Durham, NC 27703 USA Tel: +1.919.313.5300 www. CRee.Com/XLAmp XLamp XB-H LED CHArAC tEristiCs Characteristics unit Minimum t ypical Maximum Thermal resistance, junction to solder point C/W 4 Viewing angle (FWHM) degrees 110 Temperature coefficient of voltage mV/C 2.2 ESD withstand voltage (HBM per MilStd883D) v 8000 DC forward current mA 1500 Reverse voltage v 5 Forward voltage ( 700mA, 85 C) v 2.9 3.3 Forward voltage ( 1000mA, 85 C) v 3.0 Forward voltage ( 1500mA, 85 C) v 3.15 LeD junction temperature C 150 Copyright 2014-2017 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree and XLamp are registered trademarks and the Cree logo is a trademark of Cree, Inc. UL and the UR logo are registered trademarks of UL LLC. 2