CLD-DS71 Rev 2C Product family data sheet cree Xlamp Xh-G led Product descriPtioN features table of coNteNts Unlike common plastic packages, Package size: 3.0 X 3.0 mm Characteristics ......................... 2 XLamp XH LeDs use a ceramic Available in white, 70-minimum Flux Characteristics ................... 3 package to deliver the unique CRI cool white, 80-minimum Relative Spectral Power combination of high performance CRI white and 85- and Distribution.............................. 4 and reliability not available 90-minimum CRI warm white Relative Flux vs. Junction elsewhere in mid-power LeDs. 350 mA maximum drive current Temperature ............................ 4 The ceramic-based XH LeDs are viewing angle: 130 electrical Characteristics ............ 5 designed to deliver the long L70 Reflow solderable JEDEC Relative Flux vs. Current ........... 5 lifetimes of Crees other high-power JSTD020C compatible Typical Spatial Distribution ......... 6 LeDs, such as XP or XT LeDs, as well Unlimited floor life at Thermal Design ........................ 6 as industryleading LED efficacy 30 C/85% RH Reflow Soldering Characteristics . 7 levels. RoHS- and ReACh-compliant Notes ...................................... 8 UL-recognized component Mechanical Dimensions.............. 9 Optimized for fluorescent (e349212) Tape and Reel ........................ 10 replacement lighting applications, Packaging .............................. 11 such as troffers and panel lights, where high efficacy, long lifetime and smooth appearance are critical, the XH LeDs allow lighting manufacturers to offer products that meet the lifetime expectations of LeD technology. Copyright 2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree , the Cree logo Cree, Inc. 4600 Silicon Drive and XLamp are registered trademarks of Cree, Inc. Durham, NC 27703 USA Tel: +1.919.313.5300 www.CREE.COm/XLampxlamp xH-G led characteristics characteristics unit minimum typical maximum Thermal resistance, junction to solder point C/w 20 viewing angle (FWHM) degrees 130 Temperature coefficient of voltage mV/C -1.2 eSD withstand voltage (HBM per Mil-Std-883D) v 8000 DC forward current mA 350 Reverse voltage v -5 Forward voltage ( 65 mA, 25 C) v 2.9 3.4 LeD junction temperature C 150 Copyright 2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree , the Cree logo and XLamp are registered trademarks of Cree, Inc. 22