Electronut Labs 25th June, 2019 BLIP Overview and features Blip is a development board for Bluetooth Low Energy (BLE) and 802.15.4 based wireless applications, based ontheNordic Semiconductor nRF52840 SoC. It has a Black Magic Probe compatible programmeranddebuggeron-board, along withtemperature/humiditysensor,ambient light sensor, anda3-axisaccelerometer.It is usable to prototype for very low power applications, and debugger and regulator canbedisconnectedwhenonlySoCneeds to be powered. Features: Raytac MDBT50 module with Nordic nRF52840 BLE/802.15.4 SoC 32-bit ARM Cortex-M4F processor, 1MB flash + 256 kB RAM Power Supply: USB, Lipo, Vext 1.8V - 3.3V Built in 3.3V LDO for USB and Lipo MicroSD slot Bluetooth 5 support for long range and high throughput. 802.15.4 radio support LIS2DDH12 High-performance 3-axis femto accelerometer Optical Sensor LTR-329ALS-01 Si7006-A20 I2C humidity and temperature sensor. On board STM32F103CBT6 Black magic probe debugger. Operating conditions Maximum Input Voltage - USB powered : 5V - power switch on R EG position - Vext = 1.8V to 3.3V - power switch on VEXT position - Vbat = 4.2V Temperature Rating -40 to +85 On-board voltage 3.3V, 250mA maximum current output regulator electronut.in info electronut.in Electronut Labs Power supply options Blip can be powered in three ways, either using (either of the two)USB,batteryconnector,or using theVEXTheaderontheboard.Bliphasapowerselectionswitchtoselectpowersupply option, select VREG for USB and battery connector, VEXT headers for external power source. In VREG position, Blip is powered by output of on-board 3.3V regulator. (Vdd = Vreg) In VEXT position, Blip is directly powered from voltage at VEXT pin. (Vdd = Vext) Warning: VEXT must not exceed 3.3V Board Layout electronut.in info electronut.in