VME64, VME64x Terminator Technical Data Sheet RoHS Compliant Parts Available Description Features This Thevenin termination network provides high performance 8-Bit Termination Network resistor termination for VME64 and VME64x back planes. VME64, VME64x Compliant Low Channel Capacitance Designed with a ceramic substrate, this device minimizes Laser Trimmed Resistance to 1% parasitic capacitance and inductance, a primary cause of Slim BGA Package reduced system performance. In addition, the BGA package RoHS Compliant Designs Available eases touting design, saving the designer many hours of Compatible with both lead and lead printed circuit layout. free processes The BGA packaging has been proven to reduce rework and improve reliability Electrical Specifications Style G Resistor Tolerance: 1.0% 3 R1 TCR 200ppm/ C 2 Operating Temperature Range -55 C to +125 C R2 1 Maximum Resistor Power: 0.05 Watts at 70 C Maximum Package Power: AB C DE F G H 1.0 Watts at 70 C Process Requirements: Maximum Re-flow Temperature Per IPC/JEDEC J-STD-020C Typical Applications VME64x Backplane 3.3V 3.3V Card Card Card Card RT2211 RT2211 Standard Low Voltage Termination Termination VME64 VME64x +5V +3.3V 330 220 470 1.8K RT2210 RT2211 Ordering Information Packaging Information Part Number Coding 7 inch reel, Add TR7 to part number, example RT2210B7TR7 Standard R1 R2 Array Size Pitch (mm) RoHS Suffix TR7 TR13 13 inch reel, Add TR13 to part Part No. Part No. number, example RT2210B7TR13 Tape Width 24 mm 24mm RT1210B7 330 470 3 x 8 1.00 RT2210B7 (Bulk packaging is not available) RT1211B7 220 1800 3 x 8 1.00 RT2211B7 Carrier Pitch 8 mm 8 mm Reel Diameter 7 inch 13 inch Parts/Reel 1,000 4,000 Direction of Feed 2006 CTS Corporation. All rights reserved. Information subject to change CTS Electronic Components Page 1 April 08 www.ctscorp.com VME64 & VME64x Terminators Recommended Land Pattern BGA Routing Schemes Blind vias to ground Blind vias to V Outline of Substrate CC Blind vias to ground Termination Island reference pla ne layer reference pla ne layer reference plane layer recommended o n recommended o n recommended on every oth er row as every oth er row as every other row as shown. shown. shown. Vias to Vcc Solder mask is used to define the ball pads. Solder Mask Dia = Pad Diameter +.15mm (.006 inch) PCB Pad Diameter 1.00 mm Pitch (B7) = 0.51mm/.020 inch For .006 Thick Solder Paste Stencil, Aperture Opening Should be Equal to the PCB Pad Diameter. Refer to www.ctscorp.com/components/clearone.asp for additional PCB design information Option A Option B Mechanical Diagram L H W RT 2 B7 CTS YRWK P (Pitch) A1 Identifier K P (Pitch) D 1.0mm Pitch L W H P D K RT1210B7 mm 8.00 0.15 3.00 0.15 1.19 0.15 1.00 0.25 0.64 0.05 0.50 0.25 RT1211B7 RT2210B7 inch .315 .006 .118 .006 .047 .006 .039 .010 .025 .002 .020 .010 RT2211B7 Complete ClearONE Product, Processing, and Application Information can be found at the following link: