T5321, T5322, T5323, T5324 T5421, T5422, T5423, T5424 5X7 mm Surface Mount High Reliability Tristate/Non-Tristate, 1 MHz to 100MHz Hi-Reliability Product Specification XO Features Description Leadless chip carrier package is hermetically sealed for These high reliability oscillators provide HCMOS superior aging and field performance clock waveforms for applications subjected to the Crystal angle controlled to +/- 1 minute for excellent most stringent environmental conditions. They are temperature stability 168 hour Class B burn-in and extensive environmental mechanically robust and weigh less than 0.2 grams. testing for best performance in rugged field environments This 5X7 mm SMD package has a hermetic seal, Start-up time less than 10 ms, typical thus ensuring the integrity of each oscillator. Each Tristate option available oscillator is burned-in at 125C for 168 hours, 6 Calculated MTBF is 3.8 X 10 hours at 125C temperature cycled and centrifuged then fully Typical Applications tested in accordance with Table 1. Reliability tests Surface Mounted PCB projects requiring high reliability are performed per Table 2. The calculated MTBF is 6 HCMOS clock waveforms 3.8X10 at 125C. Models Operating Frequency Stability Temperature T5321 -55 to + 85C +/- .0025% (+/- 25ppm) Connections T5322 -55 to + 85C +/- .005% (+/- 50ppm) Pad T5321, T5322, T5421, T5422, T5323 -55 to + 125C +/- .0075% (+/- 75ppm) T5323, T5324 T5423, T5424 T5324 -55 to + 125C +/- .005% (+/- 50ppm) N.C. Tristate 1. T5421 -55 to + 85C +/- .0025% (+/- 25ppm) 2. Ground Ground -55 to + 85C +/- .005% (+/- 50ppm) T5422 3. Output Output T5423 -55 to + 125C +/- .0075% (+/- 75ppm) 4. +3.3V, V +3.3V, V DD DD T5424 -55 to + 125C +/- .005% (+/- 50ppm) Valpey Fisher Corporation 75 South Street, Hopkinton, MA 01748 Tel. 1-800-XTALREP, 508-435-6831 FAX 508 4355289 1 T5321, T5322, T5323, T5324 T5421, T5422, T5423, T5424 5X7 mm Surface Mount High Reliability Tristate/Non-Tristate, 1 MHz to 100MHz ELECTRICAL SPECIFICATIONS ENVIRONMENTAL SPECIFICATIONS Shock-1000 Gs, 0.35 ms, sine wave, 3 shocks in each plane Frequency Range Vibration-10-2000 Hz of .06 d.a. or 20Gs, whichever is less Fixed Output 1 MHz to 100MHz Humidity-Resistant to 85 R.H. at 85C Frequency Stability Includes calibration at 25C, operating temperature, change of input voltage, change of load, shock and vibration. Table 1 MIN TYP MAX Each unit undergoes the following: UNITS 1. Stabilization Bake MIL-STD-883 Method 1008, Cond,.B Input Voltage, V 3.0 3.3 3.6 volts DD 2. Temperature Cycling MIL-STD-883 Method 1010, Cond, B 3. Constant Acceleration MIL-STD-883 Method 2001, Cond, A Input Current 16 mA 4. Burn-in MIL-STD-883 Method 1015, Cond B (125C for 168 hours with bias) Waveform Symmetry, 5. Fine Leak MIL-STD-883 Method 1014, Cond. A1 Measured at 50%V 40/60 45/55 60/40 percent 6. Gross Leak MIL-STD-883 Method 1014, Cond C DD 7. Electrical Test at 25C and temperature extremes, as follows: Rise and Fall Time A. Frequency F. Duty Cycle B. Current G. Frequency at 3.6V CMOS, 15 pf, C. Rise Time H. Frequency at 3.0V 20 to 80% (<60 MHz) 3.0 4.0 ns D. Fall Time I. Zero logic level 20 to 80% (>60 MHz) 2.0 2.5 ns E. Duty Cycle J. One logic level CMOS, 30 pf, K. Tristate 20 to 80% (<60 MHz) 4.0 5.0 ns Test Data on each unit is available for additional cost 20 to 80% (>60 MHz) 3.0 4.5 ns Zero Level, Sinking 16 mA 0.4 volts One Level Sourcing 8 mA V -0.4V volts DD Aging First year 3 ppm After first year 1 ppm/yr Input Requirements for Pin 1.: THERMAL CHARACTERISTICS Thermal Resistance From Junc tio n to Case, R j c 16 C/ W att SURFACE MOUNT APPLICATION These packages are designed for reflow soldering in accordance with recommended profiles. For hand-soldering, the temperature of the iron should not exceed 400C for three seconds. Valpey Fisher Corporation 75 South Street, Hopkinton, MA 01748 Tel. 1-800-XTALREP, 508-435-6831 FAX 508 4355289 2