CP185039 CUI Devices

Additional Resources: Product Page 3D Model date 10/17/2019 page 1 of 4 SERIES: CP180 DESCRIPTION: PELTIER MODULE FEATURES arcTEC structure enhanced reliability for high thermal cycling superior thermal performance silicon sealed wide T max precise temperature control solid state construction input input internal output output MODEL 1 2 3 4 5 voltage current resistance Qmax Tmax max max typ T =27C T =50C T =27C T =50C h h h h (Vdc) (A) (10%) (W) (W) (C) (C) CP185039 15.4 18 0.66 157 172 68 75 Notes: 1. Maximum voltage at T max and T =27C h 2. Maximum current to achieve T max 3. Measured by AC 4-terminal method at 25C 4. Maximum heat absorbed at cold side occurs at I , V , and T=0C max max 5. Maximum temperature difference occurs at I , V , and Q=0W (T max measured in a vacuum at 1.3 Pa) max max cuidevices.comAdditional Resources: Product Page 3D Model CUI Devices SERIES: CP180 DESCRIPTION: PELTIER MODULE date 10/17/2019 page 2 of 4 SPECIFICATIONS parameter conditions/description min typ max units solder melting temperature connection between thermoelectric pairs 235 C assembly compression 1 MPa RoHS yes MECHANICAL DRAWING units: mm MATERIAL PLATING ceramic plate 96% AL O 2 3 COLD SIDE 0.05 wire leads 20 AWG tin silicon rubber 703 RTV (between cold sealer and hot side plates) THICKNESS joint cover silicon rubber 703 RTV HOT SIDE P/N & S/N printed on cold side 0.05 marking surface 10.0 3.0 Red (+) WIDTH COLD SIDE Black (-) LENGTH 100.0 5.0 LENGTH WIDTH THICKNESS MODEL NO. (mm) (mm) (mm) CP185039 50 0.3 50 0.3 3.9 0.025 cuidevices.com