CP2088-258P CUI Devices

Additional Resources: Product Page 3D Model date 07/08/2020 page 1 of 5 SERIES: CP20-M DESCRIPTION: PELTIER MODULE FEATURES micro size (less than 10 x 10 mm) wide T max Qmax of 4.7 W Au plating available, suitable for soldering precise temperature control solid state construction input input internal output output MODEL 1 2 3 4 5 voltage current resistance Qmax Tmax max max typ T =27C T =50C T =27C T =50C h h h h (Vdc) (A) (10%) (W) (W) (C) (C) CP2088-219 3.8 2.0 1.43 4.3 4.7 70 77 6 CP2088-258P 3.8 2.0 1.43 4.3 4.7 70 77 Notes: 1. Maximum voltage at T max and T =27C h 2. Maximum current to achieve T max 3. Measured by AC 4-terminal method at 25C 4. Maximum heat absorbed at cold side occurs at I , V , and T=0C max max 5. Maximum temperature difference occurs at I , V , and Q=0W (T max measured in a vacuum at 1.3 Pa) max max 6. Gold plating on both sides. 7 SOLDERABILITY parameter conditions/description min typ max units soldering to plates soldering iron temperature 150 C Note: 7. Only for gold plated models. The solder that holds the peltier together melts at 235C. Caution must taken to not leave the soldering iron in contact with the surface too long, or damage to the peltier could occur. cuidevices.comAdditional Resources: Product Page 3D Model CUI Devices SERIES: CP20-M DESCRIPTION: PELTIER MODULE date 07/08/2020 page 2 of 5 SPECIFICATIONS parameter conditions/description min typ max units solder melting temperature connection between thermoelectric pairs 235 C assembly compression 0.8 MPa RoHS yes MECHANICAL DRAWING units: mm MATERIAL PLATING ceramic plate 96% AL O 2 3 0.25-0.3 mm wire leads tin annealed copper sealer no sealing ceramic surface Au plating on select models COLD SIDE THICKNESS HOT SIDE (+) WIDTH COLD SIDE (-) LENGTH 50.05.0 GOLD LENGTH WIDTH THICKNESS MODEL NO. PLATING HOT/ (mm) (mm) (mm) COLD SIDES CP2088-219 8.8 0.3 8.8 0.3 2.19 0.15 NO CP2088-258P 8.8 0.3 8.8 0.3 2.58 0.15 YES cuidevices.com