CP30444 CUI Devices

Additional Resources: Product Page 3D Model date 10/18/2019 page 1 of 9 SERIES: CP30H DESCRIPTION: PELTIER MODULE FEATURES arcTEC structure on select models enhanced reliability for high thermal cycling superior thermal performance silicon sealed wide T max low profile precise temperature control solid state construction input input internal output output MODEL 1 2 3 4 5 voltage current resistance Qmax Tmax max max typ T =27C T =50C T =27C T =50C h h h h (Vdc) (A) (10%) (W) (W) (C) (C) CP30138H 3.8 3.0 1.0 7.3 8.0 70 77 CP30238H 8.8 3.0 2.20 16.6 18.0 70 77 CP30239H 6.0 3.0 1.5 10.3 11.3 70 77 CP30301538H 7.6 3.0 1.95 14.7 16.1 70 77 6 CP303385H 15.7 3.0 4.0 29.8 32.5 70 77 6 CP30444 19.5 3.0 4.8 34 37 70 77 Notes: 1. Maximum voltage at T max and T =27C h 2. Maximum current to achieve T max 3. Measured by AC 4-terminal method at 25C 4. Maximum heat absorbed at cold side occurs at I , V , and T=0C max max 5. Maximum temperature difference occurs at I , V , and Q=0W (T max measured in a vacuum at 1.3 Pa) max max 6. Designed with arcTEC structure. cuidevices.comAdditional Resources: Product Page 3D Model CUI Devices SERIES: CP30H DESCRIPTION: PELTIER MODULE date 10/18/2019 page 2 of 9 SPECIFICATIONS parameter conditions/description min typ max units solder melting temperature connection between thermoelectric pairs 235 C assembly compression 1 MPa RoHS yes MECHANICAL DRAWING units: mm MATERIAL PLATING ceramic plate 96% AL O 2 3 wire leads (CP30444) 20 AWG tin HOT SIDE 0.05 wire leads (all other 22 AWG tin models) THICKNESS silicon rubber 703 RTV (between sealer cold and hot side plates) COLD SIDE 0.05 joint cover silicon rubber 703 RTV P/N & S/N printed on cold side marking surface 10.0 3.0 Red (+) WIDTH COLD SIDE Black (-) LENGTH 100.0 5.0 LENGTH WIDTH THICKNESS MODEL NO. (mm) (mm) (mm) CP30138H 15 0.3 15 0.3 3.8 0.025 CP30238H 20 0.3 20 0.3 3.8 0.025 CP30239H 20 0.3 20 0.3 3.9 0.1 CP30301538H 30 0.3 15 0.3 3.8 0.025 CP303385H 30 0.3 30 0.3 3.85 0.02 CP30444 40 0.3 40 0.3 4.4 0.1 cuidevices.com