X-On Electronics has gained recognition as a prominent supplier of HSB01-080808 Heat Sinks across the USA, India, Europe, Australia, and various other global locations. HSB01-080808 Heat Sinks are a product manufactured by CUI Devices. We provide cost-effective solutions for Heat Sinks, ensuring timely deliveries around the world.

HSB01-080808 CUI Devices

HSB01-080808 electronic component of CUI Devices
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See Product Specifications
Part No.HSB01-080808
Manufacturer: CUI Devices
Category: Heat Sinks
Description: Heat Sinks heat sink, BGA, 8.5 x 8.5 x 8 mm
Datasheet: HSB01-080808 Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1: USD 0.7415 ea
Line Total: USD 0.74 
Availability - 1608
Ship by Thu. 28 Nov to Mon. 02 Dec
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
3503
Ship by Mon. 02 Dec to Fri. 06 Dec
MOQ : 50
Multiples : 1
50 : USD 0.8672
250 : USD 0.7434
1000 : USD 0.6607
3672 : USD 0.6338
7344 : USD 0.6265
11016 : USD 0.6202
18360 : USD 0.614
25704 : USD 0.6078

1608
Ship by Thu. 28 Nov to Mon. 02 Dec
MOQ : 1
Multiples : 1
1 : USD 0.7415
10 : USD 0.7034
25 : USD 0.6769
50 : USD 0.6653
100 : USD 0.6492
250 : USD 0.6156
500 : USD 0.5856
1000 : USD 0.5648
3672 : USD 0.5371

   
Manufacturer
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Heatsink Material
Fin Style
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We are delighted to provide the HSB01-080808 from our Heat Sinks category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the HSB01-080808 and other electronic components in the Heat Sinks category and beyond.

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Additional Resources: Product Page 3D Model date 06/24/2021 page 1 of 3 MODEL: HSB01-080808 DESCRIPTION: HEAT SINK FEATURES BGA design small footprint aluminum alloy black anodized finish 1 thermal resistance power MODEL 1 dissipation 75C T, 1 W, 1 W, 1 W, 75C T, nat conv nat conv 200 LFM 400 LFM nat conv (C/W) (C/W) (C/W) (C/W) (W) HSB01-080808 39.10 43.30 16.00 11.20 1.92 Note: 1. See performance curves for full thermal resistance details. PERFORMANCE CURVES 160 140 Without Airow Heatsink Temperature Rise Above 120 Ambient (T = Ths - Ta) (C) 200 LFM Power Natural 200 LFM 400 LFM 400 LFM 100 (W) Conv. 0 0 0 0 80 1 43.3 16.0 11.2 2 79.0 30.6 21.9 60 3 112.3 43.7 32.5 40 4 136.1 57.4 43.2 Ths: hot spot temperature measured on the heatsink 20 Ta: ambient temperature 0 012345 Heat Dissipated (W) cuidevices.com Mounting Surface Temperature Rise Above Ambient (C)Additional Resources: Product Page 3D Model CUI Devices MODEL: HSB01-080808 DESCRIPTION: HEAT SINK date 06/24/2021 page 2 of 3 MECHANICAL DRAWING units: mm MATERIAL AL 6063-T5 tolerance: 0.38 mm FINISH black anodized WEIGHT 1.9 g cuidevices.com

Tariff Desc

7612.90.00 -Other Aluminium structures (excluding prefabricated buildings of heading no. 94.06) and parts of structures (for example, bridges and bridge-sections, towers, lattice masts, roofs, roofing frameworks, doors and windows and their frames and thresholds for doors, balustrades, pillars and columns); aluminium plates, rods, profiles, tubes and the like, prepared for use in structures:
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