HSB03-121218 CUI Devices

Additional Resources: Product Page 3D Model date 06/24/2021 page 1 of 3 MODEL: HSB03-121218 DESCRIPTION: HEAT SINK FEATURES BGA design small footprint aluminum alloy black anodized finish 1 thermal resistance power MODEL 1 dissipation 75C T, 1 W, 1 W, 1 W, 75C T, nat conv nat conv 200 LFM 400 LFM nat conv (C/W) (C/W) (C/W) (C/W) (W) HSB03-121218 24.01 28.8 9.6 6.8 3.12 Note: 1. See performance curves for full thermal resistance details. PERFORMANCE CURVES 140 Without Airow 120 Heatsink Temperature Rise Above 200 LFM Ambient (T = Ths - Ta) (C) 100 400 LFM Power Natural 200 LFM 400 LFM (W) Conv. 80 0 0 0 0 60 1 28.8 9.6 6.8 2 52.8 18.7 13.1 40 3 73.2 27.6 19.4 4 93.5 36.6 25.7 20 5 111.9 45.3 31.9 6 128.7 54.5 38.5 0 Ths: hot spot temperature measured on the heatsink 0123456 7 Ta: ambient temperature Heat Dissipated (W) cuidevices.com Mounting Surface Temperature Rise Above Ambient (C)Additional Resources: Product Page 3D Model CUI Devices MODEL: HSB03-121218 DESCRIPTION: HEAT SINK date 06/24/2021 page 2 of 3 MECHANICAL DRAWING units: mm MATERIAL AL 6063-T5 tolerance: 0.38 mm FINISH black anodized WEIGHT 3.8 g cuidevices.com