X-On Electronics has gained recognition as a prominent supplier of HSB03-141406 Heat Sinks across the USA, India, Europe, Australia, and various other global locations. HSB03-141406 Heat Sinks are a product manufactured by CUI Devices. We provide cost-effective solutions for Heat Sinks, ensuring timely deliveries around the world.

HSB03-141406 CUI Devices

HSB03-141406 electronic component of CUI Devices
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See Product Specifications
Part No.HSB03-141406
Manufacturer: CUI Devices
Category: Heat Sinks
Description: Heat Sinks heat sink, BGA, 14 x 14 x 6 mm
Datasheet: HSB03-141406 Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1: USD 0.7888 ea
Line Total: USD 0.79 
Availability - 1388
Ship by Thu. 28 Nov to Mon. 02 Dec
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
3139
Ship by Mon. 02 Dec to Fri. 06 Dec
MOQ : 50
Multiples : 1
50 : USD 1.4175
250 : USD 0.9004
1000 : USD 0.8072
3672 : USD 0.7009
7344 : USD 0.6773
11016 : USD 0.6694
18360 : USD 0.6628
25704 : USD 0.6563

1388
Ship by Thu. 28 Nov to Mon. 02 Dec
MOQ : 1
Multiples : 1
1 : USD 0.7888
10 : USD 0.7658
100 : USD 0.7392
250 : USD 0.6572
500 : USD 0.648
1000 : USD 0.6144
3672 : USD 0.5383

   
Manufacturer
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Heatsink Material
Fin Style
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We are delighted to provide the HSB03-141406 from our Heat Sinks category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the HSB03-141406 and other electronic components in the Heat Sinks category and beyond.

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Additional Resources: Product Page 3D Model date 06/24/2021 page 1 of 3 MODEL: HSB03-141406 DESCRIPTION: HEAT SINK FEATURES BGA design small footprint aluminum alloy black anodized finish 1 thermal resistance power MODEL 1 dissipation 75C T, 1 W, 1 W, 1 W, 75C T, nat conv nat conv 200 LFM 400 LFM nat conv (C/W) (C/W) (C/W) (C/W) (W) HSB03-141406 35.98 39.7 15.8 11.6 2.08 Note: 1. See performance curves for full thermal resistance details. PERFORMANCE CURVES 140 Without Airow 120 200 LFM Heatsink Temperature Rise Above Ambient (T = Ths - Ta) (C) 100 400 LFM Power Natural 200 LFM 400 LFM (W) Conv. 80 0 0 0 0 1 39.7 15.8 11.6 60 2 73.2 30.9 22.7 40 3 103.0 45.9 33.6 4 129.7 61.1 45.0 20 Ths: hot spot temperature measured on the heatsink Ta: ambient temperature 0 012345 Heat Dissipated (W) cuidevices.com Mounting Surface Temperature Rise Above Ambient (C)Additional Resources: Product Page 3D Model CUI Devices MODEL: HSB03-141406 DESCRIPTION: HEAT SINK date 06/24/2021 page 2 of 3 MECHANICAL DRAWING units: mm MATERIAL AL 6063-T5 tolerance: 0.38 mm FINISH black anodized WEIGHT 1.6 g cuidevices.com

Tariff Desc

7612.90.00 -Other Aluminium structures (excluding prefabricated buildings of heading no. 94.06) and parts of structures (for example, bridges and bridge-sections, towers, lattice masts, roofs, roofing frameworks, doors and windows and their frames and thresholds for doors, balustrades, pillars and columns); aluminium plates, rods, profiles, tubes and the like, prepared for use in structures:
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