X-On Electronics has gained recognition as a prominent supplier of HSB04-171706 Heat Sinks across the USA, India, Europe, Australia, and various other global locations. HSB04-171706 Heat Sinks are a product manufactured by CUI Devices. We provide cost-effective solutions for Heat Sinks, ensuring timely deliveries around the world.

HSB04-171706 CUI Devices

HSB04-171706 electronic component of CUI Devices
HSB04-171706 CUI Devices
HSB04-171706 Heat Sinks
HSB04-171706 Thermal Management

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See Product Specifications
Part No. HSB04-171706
Manufacturer: CUI Devices
Category: Heat Sinks
Description: Heat Sinks heat sink, BGA, 17 x 17 x 6 mm
Datasheet: HSB04-171706 Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1: USD 0.9581 ea
Line Total: USD 0.96 
Availability - 4968
Ship by Wed. 05 Feb to Fri. 07 Feb
MOQ: 1  Multiples: 1
Pack Size: 1

 HSB04-171706 More Buying Options & Price Grid(s)

Availability Price Quantity
4968
Ship by Wed. 05 Feb to Fri. 07 Feb
MOQ : 1
Multiples : 1
1 : USD 0.9581
10 : USD 0.8341
25 : USD 0.7951
50 : USD 0.7138
100 : USD 0.6884
250 : USD 0.6641
500 : USD 0.6399
1000 : USD 0.6364
3872 : USD 0.5948

Specifications

   
Manufacturer
Product Category
Product
Mounting Style
Heatsink Material
Fin Style
Thermal Resistance
Length
Width
Height
Designed for
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Notes:- Show Stocked Products With Similar Attributes.

We are delighted to provide the HSB04-171706 from our Heat Sinks category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the HSB04-171706 and other electronic components in the Heat Sinks category and beyond.

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Additional Infomation About Product

Additional Resources: Product Page 3D Model date 06/24/2021 page 1 of 3 MODEL: HSB04-171706 DESCRIPTION: HEAT SINK FEATURES BGA design small footprint aluminum alloy black anodized finish 1 thermal resistance power MODEL 1 dissipation 75C T, 1 W, 1 W, 1 W, 75C T, nat conv nat conv 200 LFM 400 LFM nat conv (C/W) (C/W) (C/W) (C/W) (W) HSB04-171706 29.73 34.5 13.1 9.3 2.52 Note: 1. See performance curves for full thermal resistance details. PERFORMANCE CURVES 140 Without Airow 120 200 LFM Heatsink Temperature Rise Above Ambient (T = Ths - Ta) (C) 100 400 LFM Power Natural 200 LFM 400 LFM (W) Conv. 80 0 0 0 0 60 1 34.5 13.1 9.3 2 62.9 25.8 18.2 40 3 88.6 38.2 27.0 4 111.3 51.3 36.2 20 5 133.0 63.6 44.8 Ths: hot spot temperature measured on the heatsink 0 Ta: ambient temperature 0123456 Heat Dissipated (W) cuidevices.com Mounting Surface Temperature Rise Above Ambient (C)Additional Resources: Product Page 3D Model CUI Devices MODEL: HSB04-171706 DESCRIPTION: HEAT SINK date 06/24/2021 page 2 of 3 MECHANICAL DRAWING units: mm MATERIAL AL 6063-T5 tolerance: 0.38 mm FINISH black anodized WEIGHT 2.7 g cuidevices.com

HS Compliance

Tariff Desc

7612.90.00 -Other Aluminium structures (excluding prefabricated buildings of heading no. 94.06) and parts of structures (for example, bridges and bridge-sections, towers, lattice masts, roofs, roofing frameworks, doors and windows and their frames and thresholds for doors, balustrades, pillars and columns); aluminium plates, rods, profiles, tubes and the like, prepared for use in structures:

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