X-On Electronics has gained recognition as a prominent supplier of HSB06-181810 Heat Sinks across the USA, India, Europe, Australia, and various other global locations. HSB06-181810 Heat Sinks are a product manufactured by CUI Devices. We provide cost-effective solutions for Heat Sinks, ensuring timely deliveries around the world.

HSB06-181810 CUI Devices

HSB06-181810 electronic component of CUI Devices
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Part No.HSB06-181810
Manufacturer: CUI Devices
Category: Heat Sinks
Description: Heat Sinks heat sink, BGA, 18 x 18 x 10 mm
Datasheet: HSB06-181810 Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
25: USD 1.2692 ea
Line Total: USD 31.73 
Availability - 1901
Ship by Fri. 29 Nov to Thu. 05 Dec
MOQ: 25  Multiples: 1
Pack Size: 1

 HSB06-181810 More Buying Options & Price Grid(s)

Availability Price Quantity
1901
Ship by Fri. 29 Nov to Thu. 05 Dec
MOQ : 25
Multiples : 1
25 : USD 1.2692
250 : USD 1.0316
500 : USD 0.9857
1960 : USD 0.9437
3920 : USD 0.9043
5880 : USD 0.8807
7840 : USD 0.8676
11760 : USD 0.8426

Specifications

   
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Hts Code
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Notes:- Show Stocked Products With Similar Attributes.

We are delighted to provide the HSB06-181810 from our Heat Sinks category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the HSB06-181810 and other electronic components in the Heat Sinks category and beyond.

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Additional Infomation About Product

Additional Resources: Product Page 3D Model date 06/24/2021 page 1 of 3 MODEL: HSB06-181810 DESCRIPTION: HEAT SINK FEATURES BGA design small footprint aluminum alloy black anodized finish 1 thermal resistance power MODEL 1 dissipation 75C T, 1 W, 1 W, 1 W, 75C T, nat conv nat conv 200 LFM 400 LFM nat conv (C/W) (C/W) (C/W) (C/W) (W) HSB06-181810 23.68 29.1 8.8 6.1 3.17 Note: 1. See performance curves for full thermal resistance details. PERFORMANCE CURVES 120 Without Airow 100 Heatsink Temperature Rise Above 200 LFM Ambient (T = Ths - Ta) (C) 80 Power Natural 400 LFM 200 LFM 400 LFM (W) Conv. 0 0 0 0 60 1 29.1 8.8 6.1 2 52.2 17.3 12.0 40 3 72.8 25.8 17.9 4 91.6 34.1 23.6 20 5 109.5 42.6 29.6 Ths: hot spot temperature measured on the heatsink 0 Ta: ambient temperature 0123456 Heat Dissipated (W) cuidevices.com Mounting Surface Temperature Rise Above Ambient (C)Additional Resources: Product Page 3D Model CUI Devices MODEL: HSB06-181810 DESCRIPTION: HEAT SINK date 06/24/2021 page 2 of 3 MECHANICAL DRAWING units: mm MATERIAL AL 6063-T5 tolerance: 0.38 mm FINISH black anodized WEIGHT 3.7 g cuidevices.com

HS Compliance

Tariff Desc

7612.90.00 -Other Aluminium structures (excluding prefabricated buildings of heading no. 94.06) and parts of structures (for example, bridges and bridge-sections, towers, lattice masts, roofs, roofing frameworks, doors and windows and their frames and thresholds for doors, balustrades, pillars and columns); aluminium plates, rods, profiles, tubes and the like, prepared for use in structures:

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