X-On Electronics has gained recognition as a prominent supplier of HSB10-232306 Heat Sinks across the USA, India, Europe, Australia, and various other global locations. HSB10-232306 Heat Sinks are a product manufactured by CUI Devices. We provide cost-effective solutions for Heat Sinks, ensuring timely deliveries around the world.

HSB10-232306 CUI Devices

HSB10-232306 electronic component of CUI Devices
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See Product Specifications
Part No.HSB10-232306
Manufacturer: CUI Devices
Category: Heat Sinks
Description: Heat Sinks heat sink, BGA, 23 x 23 x 6 mm
Datasheet: HSB10-232306 Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1: USD 0.8535 ea
Line Total: USD 0.85 
Availability - 1673
Ship by Thu. 28 Nov to Mon. 02 Dec
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
803
Ship by Mon. 02 Dec to Fri. 06 Dec
MOQ : 50
Multiples : 1
50 : USD 0.9645
250 : USD 0.7792
1872 : USD 0.7261
3744 : USD 0.7188
5616 : USD 0.6672
9360 : USD 0.6604
11232 : USD 0.6539
16848 : USD 0.6473

1673
Ship by Thu. 28 Nov to Mon. 02 Dec
MOQ : 1
Multiples : 1
1 : USD 0.8535
10 : USD 0.7831
25 : USD 0.7438
50 : USD 0.7334
100 : USD 0.7046
250 : USD 0.6433
500 : USD 0.6433
1000 : USD 0.5925
5616 : USD 0.5925

   
Manufacturer
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Heatsink Material
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We are delighted to provide the HSB10-232306 from our Heat Sinks category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the HSB10-232306 and other electronic components in the Heat Sinks category and beyond.

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Additional Resources: Product Page 3D Model date 06/24/2021 page 1 of 3 MODEL: HSB10-232306 DESCRIPTION: HEAT SINK FEATURES BGA design top mount aluminum alloy black anodized finish 1 thermal resistance power MODEL 1 dissipation 75C T, 1 W, 1 W, 1 W, 75C T, nat conv nat conv 200 LFM 400 LFM nat conv (C/W) (C/W) (C/W) (C/W) (W) HSB10-232306 25.46 29.2 9.6 6.7 2.95 Note: 1. See performance curves for full thermal resistance details. PERFORMANCE CURVES 140 Without Airow 120 Heatsink Temperature Rise Above 200 LFM Ambient (T = Ths - Ta) (C) 100 400 LFM Power Natural 200 LFM 400 LFM (W) Conv. 80 0 0 0 0 1 29.2 9.6 6.7 60 2 53.9 19.2 13.4 40 3 75.9 28.3 19.6 4 95.6 37.8 25.9 20 5 116.2 46.2 32.2 Ths: hot spot temperature measured on the heatsink 0 Ta: ambient temperature 0123456 Heat Dissipated (W) cuidevices.com Mounting Surface Temperature Rise Above Ambient (C)Additional Resources: Product Page 3D Model CUI Devices MODEL: HSB10-232306 DESCRIPTION: HEAT SINK date 06/24/2021 page 2 of 3 MECHANICAL DRAWING units: mm MATERIAL AL 6063-T5 tolerance: 0.38 mm FINISH black anodized WEIGHT 4.8 g cuidevices.com

Tariff Desc

7612.90.00 -Other Aluminium structures (excluding prefabricated buildings of heading no. 94.06) and parts of structures (for example, bridges and bridge-sections, towers, lattice masts, roofs, roofing frameworks, doors and windows and their frames and thresholds for doors, balustrades, pillars and columns); aluminium plates, rods, profiles, tubes and the like, prepared for use in structures:
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