X-On Electronics has gained recognition as a prominent supplier of HSB13-303014 Heat Sinks across the USA, India, Europe, Australia, and various other global locations. HSB13-303014 Heat Sinks are a product manufactured by CUI Devices. We provide cost-effective solutions for Heat Sinks, ensuring timely deliveries around the world.

HSB13-303014 CUI Devices

HSB13-303014 electronic component of CUI Devices
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See Product Specifications
Part No.HSB13-303014
Manufacturer: CUI Devices
Category: Heat Sinks
Description: Heat Sinks heat sink, BGA, 30.7 x 30.7 x 14.1 mm
Datasheet: HSB13-303014 Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1: USD 1.0314 ea
Line Total: USD 1.03 
Availability - 904
Ship by Fri. 29 Nov to Tue. 03 Dec
MOQ: 1  Multiples: 1
Pack Size: 1

 HSB13-303014 More Buying Options & Price Grid(s)

Availability Price Quantity
698
Ship by Tue. 03 Dec to Mon. 09 Dec
MOQ : 25
Multiples : 1
25 : USD 1.6931
250 : USD 1.3781
720 : USD 1.3125
1440 : USD 1.2561
2880 : USD 1.2049
5040 : USD 1.1721
7920 : USD 1.155
10080 : USD 1.1051

904
Ship by Fri. 29 Nov to Tue. 03 Dec
MOQ : 1
Multiples : 1
1 : USD 1.0314
10 : USD 1.0291

Specifications

   
Manufacturer
Product Category
Product
Mounting Style
Heatsink Material
Fin Style
Thermal Resistance
Length
Width
Height
Designed for
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Notes:- Show Stocked Products With Similar Attributes.

We are delighted to provide the HSB13-303014 from our Heat Sinks category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the HSB13-303014 and other electronic components in the Heat Sinks category and beyond.

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Additional Infomation About Product

Additional Resources: Product Page 3D Model date 06/24/2021 page 1 of 3 MODEL: HSB13-303014 DESCRIPTION: HEAT SINK FEATURES BGA design top mount aluminum alloy black anodized finish 1 thermal resistance power MODEL 1 dissipation 75C T, 1 W, 1 W, 1 W, 75C T, nat conv nat conv 200 LFM 400 LFM nat conv (C/W) (C/W) (C/W) (C/W) (W) HSB13-303014 12.36 14.8 4.7 3.4 6.07 Note: 1. See performance curves for full thermal resistance details. PERFORMANCE CURVES 120 Without Airow 100 Heatsink Temperature Rise Above 200 LFM Ambient (T = Ths - Ta) (C) 80 400 LFM Power Natural 200 LFM 400 LFM (W) Conv. 0 0 0 0 60 1 14.8 4.7 3.4 2 28.7 9.2 6.2 40 3 41.5 13.6 9.3 4 53.5 18.4 12.5 20 5 63.9 22.8 15.4 6 74.5 27.8 18.6 0 02461 3 5 7 8191011 2 7 84.1 32.1 21.5 8 94.2 36.5 24.5 Heat Dissipated (W) 9 103.1 41.5 27.9 10 112.5 45.9 30.9 Ths: hot spot temperature measured on the heatsink Ta: ambient temperature cuidevices.com Mounting Surface Temperature Rise Above Ambient (C)Additional Resources: Product Page 3D Model CUI Devices MODEL: HSB13-303014 DESCRIPTION: HEAT SINK date 06/24/2021 page 2 of 3 MECHANICAL DRAWING units: mm MATERIAL AL 6063-T5 tolerance: 0.38 mm FINISH black anodized WEIGHT 15.0 g cuidevices.com

HS Compliance

Tariff Desc

7612.90.00 -Other Aluminium structures (excluding prefabricated buildings of heading no. 94.06) and parts of structures (for example, bridges and bridge-sections, towers, lattice masts, roofs, roofing frameworks, doors and windows and their frames and thresholds for doors, balustrades, pillars and columns); aluminium plates, rods, profiles, tubes and the like, prepared for use in structures:

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