X-On Electronics has gained recognition as a prominent supplier of HSB18-232310 Heat Sinks across the USA, India, Europe, Australia, and various other global locations. HSB18-232310 Heat Sinks are a product manufactured by CUI Devices. We provide cost-effective solutions for Heat Sinks, ensuring timely deliveries around the world.

HSB18-232310 CUI Devices

HSB18-232310 electronic component of CUI Devices
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See Product Specifications
Part No.HSB18-232310
Manufacturer: CUI Devices
Category: Heat Sinks
Description: Heat Sinks heat sink, BGA, 23 x 23 x 10 mm
Datasheet: HSB18-232310 Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
25: USD 0.9849 ea
Line Total: USD 24.62 
Availability - 1815
Ship by Wed. 25 Dec to Tue. 31 Dec
MOQ: 25  Multiples: 1
Pack Size: 1

 HSB18-232310 More Buying Options & Price Grid(s)

Availability Price Quantity
1815
Ship by Wed. 25 Dec to Tue. 31 Dec
MOQ : 25
Multiples : 1
25 : USD 0.9849
250 : USD 0.7968
500 : USD 0.7612
1872 : USD 0.7498
3744 : USD 0.7383
5616 : USD 0.7282
9360 : USD 0.7167
16848 : USD 0.7066

501
Ship by Mon. 23 Dec to Wed. 25 Dec
MOQ : 1
Multiples : 1
1 : USD 0.8287
10 : USD 0.7627
25 : USD 0.7426
50 : USD 0.7269

Specifications

   
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We are delighted to provide the HSB18-232310 from our Heat Sinks category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the HSB18-232310 and other electronic components in the Heat Sinks category and beyond.

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Additional Infomation About Product

Additional Resources: Product Page 3D Model date 06/24/2021 page 1 of 3 MODEL: HSB18-232310 DESCRIPTION: HEAT SINK FEATURES BGA design top mount aluminum alloy black anodized finish 1 thermal resistance power MODEL 1 dissipation 75C T, 1 W, 1 W, 1 W, 75C T, nat conv nat conv 200 LFM 400 LFM nat conv (C/W) (C/W) (C/W) (C/W) (W) HSB18-232310 20.41 24.0 6.8 4.7 3.67 Note: 1. See performance curves for full thermal resistance details. PERFORMANCE CURVES 140 Without Airow 120 200 LFM Heatsink Temperature Rise Above Ambient (T = Ths - Ta) (C) 100 400 LFM Power Natural 200 LFM 400 LFM (W) Conv. 80 0 0 0 0 60 1 24.0 6.8 4.7 2 45.6 13.4 9.1 40 3 64.3 19.8 13.4 4 81.7 26.6 17.8 20 5 99.0 33.1 22.1 0 6 114.1 39.9 26.7 02461357 8 7 129.3 46.6 31.1 Ths: hot spot temperature measured on the heatsink Ta: ambient temperature Heat Dissipated (W) cuidevices.com Mounting Surface Temperature Rise Above Ambient (C)Additional Resources: Product Page 3D Model CUI Devices MODEL: HSB18-232310 DESCRIPTION: HEAT SINK date 06/24/2021 page 2 of 3 MECHANICAL DRAWING units: mm MATERIAL AL 6063-T5 tolerance: 0.38 mm FINISH black anodized WEIGHT 4.8 g cuidevices.com

HS Compliance

Tariff Desc

7612.90.00 -Other Aluminium structures (excluding prefabricated buildings of heading no. 94.06) and parts of structures (for example, bridges and bridge-sections, towers, lattice masts, roofs, roofing frameworks, doors and windows and their frames and thresholds for doors, balustrades, pillars and columns); aluminium plates, rods, profiles, tubes and the like, prepared for use in structures:

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