X-On Electronics has gained recognition as a prominent supplier of HSB20-353525 Heat Sinks across the USA, India, Europe, Australia, and various other global locations. HSB20-353525 Heat Sinks are a product manufactured by CUI Devices. We provide cost-effective solutions for Heat Sinks, ensuring timely deliveries around the world.

HSB20-353525 CUI Devices

HSB20-353525 electronic component of CUI Devices
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See Product Specifications
Part No.HSB20-353525
Manufacturer: CUI Devices
Category: Heat Sinks
Description: Heat Sinks heat sink, BGA, 35 x 35 x 25 mm
Datasheet: HSB20-353525 Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1: USD 2.1021 ea
Line Total: USD 2.1 
Availability - 610
Ship by Thu. 28 Nov to Mon. 02 Dec
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
610
Ship by Thu. 28 Nov to Mon. 02 Dec
MOQ : 1
Multiples : 1
1 : USD 2.1021
10 : USD 1.9519
25 : USD 1.8942
50 : USD 1.8249
100 : USD 1.7787
250 : USD 1.6863
500 : USD 1.6632
1000 : USD 1.5939

   
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We are delighted to provide the HSB20-353525 from our Heat Sinks category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the HSB20-353525 and other electronic components in the Heat Sinks category and beyond.

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Additional Resources: Product Page 3D Model date 06/24/2021 page 1 of 3 MODEL: HSB20-353525 DESCRIPTION: HEAT SINK FEATURES BGA design top mount aluminum alloy black anodized finish 1 thermal resistance power MODEL 1 dissipation 75C T, 1 W, 1 W, 1 W, 75C T, nat conv nat conv 200 LFM 400 LFM nat conv (C/W) (C/W) (C/W) (C/W) (W) HSB20-353525 6.65 9.9 2.7 1.9 11.28 Note: 1. See performance curves for full thermal resistance details. PERFORMANCE CURVES 100 90 Without Airow 80 200 LFM Heatsink Temperature Rise Above Ambient (T = Ths - Ta) (C) 70 400 LFM Power Natural 200 LFM 400 LFM 60 (W) Conv. 0 0 0 0 50 1 9.9 2.7 1.9 40 2 18.9 5.0 3.4 30 3 26.5 7.3 5.0 20 4 33.6 9.9 6.7 10 5 39.9 12.4 8.2 0 6 46.0 14.8 9.9 0123456789 10 11 12 13 14 15 16 7 51.9 17.1 11.4 8 57.7 19.7 13.1 Heat Dissipated (W) 9 63.2 22.2 14.6 10 69.1 24.7 16.3 11 74.0 27.0 17.9 12 78.7 29.4 19.4 13 84.0 32.0 21.1 14 89.0 34.3 22.6 15 93.4 36.5 24.2 Ths: hot spot temperature measured on the heatsink Ta: ambient temperature cuidevices.com Mounting Surface Temperature Rise Above Ambient (C)Additional Resources: Product Page 3D Model CUI Devices MODEL: HSB20-353525 DESCRIPTION: HEAT SINK date 06/24/2021 page 2 of 3 MECHANICAL DRAWING units: mm MATERIAL AL 6063-T5 tolerance: 0.38 mm FINISH black anodized WEIGHT 20.0 g cuidevices.com

Tariff Desc

7612.90.00 -Other Aluminium structures (excluding prefabricated buildings of heading no. 94.06) and parts of structures (for example, bridges and bridge-sections, towers, lattice masts, roofs, roofing frameworks, doors and windows and their frames and thresholds for doors, balustrades, pillars and columns); aluminium plates, rods, profiles, tubes and the like, prepared for use in structures:
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