X-On Electronics has gained recognition as a prominent supplier of HSB22-606010 Heat Sinks across the USA, India, Europe, Australia, and various other global locations. HSB22-606010 Heat Sinks are a product manufactured by CUI Devices. We provide cost-effective solutions for Heat Sinks, ensuring timely deliveries around the world.

HSB22-606010 CUI Devices

HSB22-606010 electronic component of CUI Devices
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See Product Specifications
Part No.HSB22-606010
Manufacturer: CUI Devices
Category: Heat Sinks
Description: Heat Sinks heat sink, BGA, 60 x 60 x 10 mm
Datasheet: HSB22-606010 Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1: USD 3.7422 ea
Line Total: USD 3.74 
Availability - 828
Ship by Fri. 29 Nov to Tue. 03 Dec
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
828
Ship by Fri. 29 Nov to Tue. 03 Dec
MOQ : 1
Multiples : 1
1 : USD 3.7422
10 : USD 3.4188
25 : USD 3.2917
50 : USD 3.234
100 : USD 2.9337
250 : USD 2.8298
500 : USD 2.4486

   
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Heatsink Material
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We are delighted to provide the HSB22-606010 from our Heat Sinks category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the HSB22-606010 and other electronic components in the Heat Sinks category and beyond.

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Additional Resources: Product Page 3D Model date 06/24/2021 page 1 of 3 MODEL: HSB21-454515 DESCRIPTION: HEAT SINK FEATURES BGA design top mount aluminum alloy black anodized finish 1 thermal resistance power MODEL 1 dissipation 75C T, 1 W, 1 W, 1 W, 75C T, nat conv nat conv 200 LFM 400 LFM nat conv (C/W) (C/W) (C/W) (C/W) (W) HSB21-454515 7.56 10.1 2.8 2.1 9.92 Note: 1. See performance curves for full thermal resistance details. PERFORMANCE CURVES 120 Without Airow 100 Heatsink Temperature Rise Above 200 LFM Ambient (T = Ths - Ta) (C) 80 400 LFM Power Natural 200 LFM 400 LFM (W) Conv. 0 0 0 0 60 1 10.1 2.8 2.1 2 19.8 5.7 4.0 40 3 28.1 8.4 5.8 4 36.1 11.3 7.9 20 5 42.9 14.2 9.7 6 49.7 17.1 11.6 0 012345678 910111213141516 7 56.7 19.9 13.4 8 63.5 22.5 15.4 Heat Dissipated (W) 9 69.6 25.2 17.2 10 75.6 28.3 19.4 11 81.7 31.0 21.1 12 87.3 33.9 23.1 13 92.6 36.8 25.1 14 97.4 39.6 26.9 15 102.7 42.1 28.8 Ths: hot spot temperature measured on the heatsink Ta: ambient temperature cuidevices.com Mounting Surface Temperature Rise Above Ambient (C)Additional Resources: Product Page 3D Model CUI Devices MODEL: HSB21-454515 DESCRIPTION: HEAT SINK date 06/24/2021 page 2 of 3 MECHANICAL DRAWING units: mm MATERIAL AL 6063-T5 tolerance: 0.38 mm FINISH black anodized WEIGHT 29.2 g cuidevices.com

Tariff Desc

7612.90.00 -Other Aluminium structures (excluding prefabricated buildings of heading no. 94.06) and parts of structures (for example, bridges and bridge-sections, towers, lattice masts, roofs, roofing frameworks, doors and windows and their frames and thresholds for doors, balustrades, pillars and columns); aluminium plates, rods, profiles, tubes and the like, prepared for use in structures:
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