HSE-B20250-040H CUI Devices

Additional Resources: Product Page 3D Model date 02/10/2020 page 1 of 5 SERIES: HSE-B20X DESCRIPTION: HEAT SINK FEATURES TO-220 package placement pins for secure PCB attachment round hole for component attchment multiple available cut lengths 1 thermal resistance power MODEL 1 dissipation length 75C T, 1 W, 1 W, 1 W, 75C T, nat conv nat conv 200 LFM 400 LFM nat conv (mm) (C/W) (C/W) (C/W) (C/W) (W) HSE-B20250-040H 25 15.00 19.57 4.28 3.44 5.00 HSE-B20270-040H 27 12.50 17.29 3.64 2.82 6.00 HSE-B20380-040H 38 10.14 13.19 3.94 2.44 7.40 HSE-B20500-040H 50 8.43 11.17 4.85 3.17 8.90 HSE-B20630-040H 63 7.81 11.54 3.73 2.31 9.60 Note: 1. See performance curves for full thermal resistance details. 2. Custom cut to length options available. Thermal data not available on custom lengths. PERFORMANCE CURVES HSE-B20250-040H 100 Without Airflow Heatsink Temperature Rise Above 90 200 LFM Ambient (T = Ths - Ta) (C) 400 LFM 80 Power Natural 200 LFM 400 LFM (W) Conv. 70 0 0 0 0 60 1 19.57 4.28 3.44 2 35.77 8.76 6.98 50 3 49.68 13.06 10.36 40 4 62.71 17.44 13.88 30 5 74.79 21.93 17.35 6 85.46 26.39 20.74 20 7 97.48 30.77 24.33 10 8 108.09 35.20 27.77 0 9 117.16 39.64 31.31 01 23 45 6 789 10 10 127.50 43.98 34.86 Dissipated Power (W) Ths: hot spot temperature measured on the heatsink Ta: ambient temperature cuidevices.com Mounting Surface Temperature Rise Above Ambient (C)Additional Resources: Product Page 3D Model CUI Devices SERIES: HSE-B20X DESCRIPTION: HEAT SINK date 02/10/2020 page 2 of 5 PERFORMANCE CURVES (CONTINUED) HSE-B20270-040H 100 Heatsink Temperature Rise Above Without Airflow 90 Ambient (T = Ths - Ta) (C) 200 LFM Power Natural 400 LFM 80 200 LFM 400 LFM (W) Conv. 0 0 0 0 70 1 17.29 3.64 2.82 60 2 30.91 7.46 5.30 50 3 43.23 11.24 7.93 4 55.60 15.12 10.61 40 5 66.37 18.95 13.43 30 6 75.86 22.92 16.06 20 7 88.12 27.03 18.81 8 98.44 30.78 21.69 10 9 107.17 34.75 24.44 0 01 23 45 6 789 10 10 114.29 38.96 27.31 Dissipated Power (W) Ths: hot spot temperature measured on the heatsink Ta: ambient temperature HSE-B20380-040H 100 Heatsink Temperature Rise Above Without Airflow 90 Ambient (T = Ths - Ta) (C) 200 LFM Power Natural 400 LFM 200 LFM 400 LFM 80 (W) Conv. 0 0 0 0 70 1 13.19 3.94 2.44 60 2 24.78 7.39 4.83 50 3 35.70 10.40 7.28 4 45.65 13.83 9.74 40 5 55.23 17.18 12.65 30 6 63.54 20.84 15.21 20 7 72.54 24.44 17.81 8 79.48 27.50 20.30 10 9 88.15 31.14 22.93 0 01 23 45 6 789 10 10 95.46 34.74 25.35 Dissipated Power (W) Ths: hot spot temperature measured on the heatsink Ta: ambient temperature cuidevices.com Mounting Surface Temperature Mounting Surface Temperature Rise Above Ambient (C) Rise Above Ambient (C)