X-On Electronics has gained recognition as a prominent supplier of HSE-B20250-040H-01 Heat Sinks across the USA, India, Europe, Australia, and various other global locations. HSE-B20250-040H-01 Heat Sinks are a product manufactured by CUI Devices. We provide cost-effective solutions for Heat Sinks, ensuring timely deliveries around the world.

HSE-B20250-040H-01 CUI Devices

HSE-B20250-040H-01 electronic component of CUI Devices
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See Product Specifications
Part No.HSE-B20250-040H-01
Manufacturer: CUI Devices
Category: Heat Sinks
Description: HSE-B20 Series 25 x 34.5 x 12.5mm 4.44°C/W Black Anodized PC Pin TO-220 Heatsink
Datasheet: HSE-B20250-040H-01 Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1: USD 0.7715 ea
Line Total: USD 0.77 
Availability - 997
Ship by Wed. 27 Nov to Fri. 29 Nov
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
1455
Ship by Fri. 29 Nov to Thu. 05 Dec
MOQ : 50
Multiples : 50
50 : USD 0.9844
250 : USD 0.8256
1500 : USD 0.7312
3000 : USD 0.7011
6000 : USD 0.6907
7500 : USD 0.6803
10500 : USD 0.6475
15000 : USD 0.6377

997
Ship by Wed. 27 Nov to Fri. 29 Nov
MOQ : 1
Multiples : 1
1 : USD 0.7715
10 : USD 0.7207
25 : USD 0.6976
250 : USD 0.6526
500 : USD 0.6445
1000 : USD 0.5994

   
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RoHS - XON
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We are delighted to provide the HSE-B20250-040H-01 from our Heat Sinks category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the HSE-B20250-040H-01 and other electronic components in the Heat Sinks category and beyond.

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Additional Resources: Product Page 3D Model date 02/10/2020 page 1 of 5 SERIES: HSE-B20X-01 DESCRIPTION: HEAT SINK FEATURES TO-220 package placement pins for secure PCB attachment slide in style multiple available cut lengths 1 thermal resistance power MODEL 1 dissipation length 75C T, 1 W, 1 W, 1 W, 75C T, nat conv nat conv 200 LFM 400 LFM nat conv (mm) (C/W) (C/W) (C/W) (C/W) (W) HSE-B20250-040H-01 25 13.64 18.58 4.44 3.30 5.50 HSE-B20380-040H-01 38 10.27 13.31 5.77 3.68 7.30 HSE-B20500-040H-01 50 8.43 11.67 2.85 1.91 8.90 HSE-B20630-040H-01 63 8.24 11.01 4.46 2.97 9.10 Note: 1. See performance curves for full thermal resistance details. 2. Custom cut to length options available. Thermal data not available on custom lengths. PERFORMANCE CURVES HSE-B20250-040H-01 100 Without Airflow Heatsink Temperature Rise Above 90 200 LFM Ambient (T = Ths - Ta) (C) 400 LFM 80 Power Natural 200 LFM 400 LFM (W) Conv. 70 0 0 0 0 1 18.58 4.44 3.30 60 2 33.32 9.59 6.21 50 3 45.87 14.21 9.38 40 4 58.26 18.79 12.55 5 69.68 23.71 15.95 30 6 82.14 28.49 19.39 20 7 92.93 32.90 22.71 10 8 102.15 37.44 25.85 9 110.43 42.50 29.39 0 01 23 45 6789 10 10 117.47 47.13 32.50 Dissipated Power (W) Ths: hot spot temperature measured on the heatsink Ta: ambient temperature cuidevices.com Mounting Surface Temperature Rise Above Ambient (C)Additional Resources: Product Page 3D Model CUI Devices SERIES: HSE-B20X-01 DESCRIPTION: HEAT SINK date 02/10/2020 page 2 of 5 PERFORMANCE CURVES (CONTINUED) HSE-B20380-040H-01 100 Without Airflow Heatsink Temperature Rise Above 90 Ambient (T = Ths - Ta) (C) 200 LFM 400 LFM Power Natural 80 200 LFM 400 LFM (W) Conv. 0 0 0 0 70 1 13.31 5.77 3.68 60 2 23.81 11.53 7.60 50 3 35.45 17.15 11.49 4 46.08 22.72 15.29 40 5 55.96 28.33 19.24 30 6 64.57 33.55 22.98 20 7 73.20 38.93 26.79 8 81.80 44.23 30.63 10 9 89.50 50.00 34.54 0 01 23 45 6789 10 10 97.33 55.53 38.67 Dissipated Power (W) Ths: hot spot temperature measured on the heatsink Ta: ambient temperature HSE-B20500-040H-01 100 Heatsink Temperature Rise Above Without Airflow 90 Ambient (T = Ths - Ta) (C) 200 LFM Power Natural 400 LFM 80 200 LFM 400 LFM (W) Conv. 70 0 0 0 0 1 11.67 2.85 1.91 60 2 22.26 5.68 4.07 50 3 31.61 8.58 6.11 4 40.44 11.07 8.18 40 5 49.31 14.07 10.26 30 6 57.03 16.67 12.51 20 7 62.88 19.49 14.23 8 69.61 22.33 16.13 10 9 76.25 25.14 18.16 0 01 23 45 6789 10 10 83.27 28.02 20.35 Dissipated Power (W) Ths: hot spot temperature measured on the heatsink Ta: ambient temperature cuidevices.com Mounting Surface Temperature Mounting Surface Temperature Rise Above Ambient (C) Rise Above Ambient (C)

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7612.90.00 -Other Aluminium structures (excluding prefabricated buildings of heading no. 94.06) and parts of structures (for example, bridges and bridge-sections, towers, lattice masts, roofs, roofing frameworks, doors and windows and their frames and thresholds for doors, balustrades, pillars and columns); aluminium plates, rods, profiles, tubes and the like, prepared for use in structures:
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