HSE-B20250-045H CUI Devices

Additional Resources: Product Page 3D Model date 02/12/2020 page 1 of 3 MODEL: HSE-B20250-045H DESCRIPTION: HEAT SINK FEATURES TO-220 package placement pins for secure PCB mounting round hole for component attachment black anodized finish 1 thermal resistance power MODEL 1 dissipation 75C T, 1 W, 1 W, 1 W, 75C T, nat conv nat conv 200 LFM 400 LFM nat conv (C/W) (C/W) (C/W) (C/W) (W) HSE-B20250-045H 9.74 12.29 4.05 2.84 7.70 Note: 1. See performance curves for full thermal resistance details. PERFORMANCE CURVES 100 Without Airflow Heatsink Temperature Rise Above 90 200 LFM Ambient (T = Ths - Ta) (C) 400 LFM 80 Power Natural 200 LFM 400 LFM (W) Conv. 70 0 0 0 0 1 12.29 4.05 2.84 60 2 23.82 7.75 6.41 50 3 34.26 11.31 9.58 40 4 44.14 15.68 12.55 5 53.47 19.34 16.03 30 6 62.05 22.49 18.96 20 7 70.15 26.38 21.56 10 8 77.35 30.60 25.15 9 84.60 34.29 28.46 0 01 23 45 67 89 10 10 90.94 37.71 31.61 Dissipated Power (W) Ths: hot spot temperature measured on the heatsink Ta: ambient temperature cuidevices.com Mounting Surface Temperature Rise Above Ambient (C)Additional Resources: Product Page 3D Model CUI Devices MODEL: HSE-B20250-045H DESCRIPTION: HEAT SINK date 02/12/2020 page 2 of 3 MECHANICAL DRAWING units: mm MATERIAL AL 6063-T5 tolerance: 0.5 mm FINISH black anodized PIN MATERIAL steel PIN PLATING tin WEIGHT 19.44 g cuidevices.com