HSE-B20254-035H CUI Devices

Additional Resources: Product Page 3D Model date 02/10/2020 page 1 of 5 SERIES: HSE-BX-02 DESCRIPTION: HEAT SINK FEATURES TO-220 package placement pins for secure PCB attachment round hole for component attachment multiple available cut lengths 1 thermal resistance power MODEL 1 dissipation length 75C T, 1 W, 1 W, 1 W, 75C T, nat conv nat conv 200 LFM 400 LFM nat conv (mm) (C/W) (C/W) (C/W) (C/W) (W) HSE-B20254-035H 25.4 12.93 14.40 3.28 2.49 5.80 HSE-B20381-035H 38.1 11.54 13.64 3.66 2.76 6.50 HSE-B20508-035H 50.8 9.62 12.98 5.17 3.28 7.80 2 HSE-B20508-035H-W 50.8 9.62 12.98 5.17 3.28 7.80 HSE-B20635-035H 63.5 8.15 10.92 4.35 2.86 9.20 2 HSE-B20635-035H-W 63.5 8.15 10.92 4.35 2.86 9.20 Note: 1. See performance curves for full thermal resistance details. 2. Placement pins with standoffs. 3. Custom cut to length options available. Thermal data not available on custom lengths. PERFORMANCE CURVES HSE-B20254-035H 100 Without Airflow Heatsink Temperature Rise Above 90 Ambient (T = Ths - Ta) (C) 200 LFM 400 LFM Power Natural 80 200 LFM 400 LFM (W) Conv. 70 0 0 0 0 1 14.40 3.28 2.49 60 2 28.52 6.90 5.02 50 3 43.03 10.51 7.48 40 4 56.78 13.98 9.87 5 67.70 17.81 12.71 30 6 77.09 21.84 14.82 20 7 86.63 25.55 17.33 10 8 95.53 29.43 19.68 9 103.32 33.25 22.19 0 01 23 45 6789 10 10 112.39 37.35 24.51 Dissipated Power (W) Ths: hot spot temperature measured on the heatsink Ta: ambient temperature cuidevices.com Mounting Surface Temperature Rise Above Ambient (C)Additional Resources: Product Page 3D Model CUI Devices SERIES: HSE-BX-02 DESCRIPTION: HEAT SINK date 02/10/2020 page 2 of 5 PERFORMANCE CURVES (CONTINUED) HSE-B20381-035H 100 Without Airflow Heatsink Temperature Rise Above 90 200 LFM Ambient (T = Ths - Ta) (C) 400 LFM 80 Power Natural 200 LFM 400 LFM (W) Conv. 70 0 0 0 0 1 13.64 3.66 2.76 60 2 25.38 6.96 5.06 50 3 40.52 10.35 7.51 40 4 51.51 13.65 9.97 5 61.79 17.05 12.65 30 6 71.27 20.69 15.04 20 7 80.06 24.37 17.45 10 8 89.74 27.82 19.84 0 9 97.27 30.95 22.10 01 23 45 67 89 10 10 105.15 34.45 24.85 Dissipated Power (W) Ths: hot spot temperature measured on the heatsink Ta: ambient temperature HSE-B20508-035H(-W) 100 Without Airflow Heatsink Temperature Rise Above 90 200 LFM Ambient (T = Ths - Ta) (C) 400 LFM 80 Power Natural 200 LFM 400 LFM (W) Conv. 70 0 0 0 0 1 12.98 5.17 3.28 60 2 23.69 10.43 7.01 50 3 33.43 16.23 9.87 40 4 43.43 22.15 14.05 30 5 52.51 27.62 18.06 6 61.06 33.03 22.24 20 7 69.25 38.72 26.25 10 8 77.11 43.92 30.07 0 9 84.38 49.28 33.81 01 2345 678 910 10 92.34 54.09 36.92 Dissipated Power (W) Ths: hot spot temperature measured on the heatsink Ta: ambient temperature cuidevices.com Mounting Surface Temperature Mounting Surface Temperature Rise Above Ambient (C) Rise Above Ambient (C)