HSE-B20254-035H-02 CUI Devices

Additional Resources: Product Page 3D Model date 02/11/2020 page 1 of 5 SERIES: HSE-BX-035H-02 DESCRIPTION: HEAT SINK FEATURES TO-220 package placement pins for secure PCB attachment round hole for component attachment multiple available cut lengths 1 thermal resistance power MODEL 1 dissipation length 75C T, 1 W, 1 W, 1 W, 75C T, nat conv nat conv 200 LFM 400 LFM nat conv (mm) (C/W) (C/W) (C/W) (C/W) (W) HSE-B20254-035H-02 25.4 13.64 15.97 4.39 3.27 5.50 HSE-B20381-035H-02 38.1 10.87 13.97 3.32 2.14 6.90 HSE-B20508-035H-01 50.8 9.15 13.03 4.76 3.21 8.20 HSE-B20635-035H-01 63.5 7.98 11.06 4.49 3.31 9.40 Note: 1. See performance curves for full thermal resistance details. 2. Custom cut to length options available. Thermal data not available on custom lengths. PERFORMANCE CURVES HSE-B20254-035H-02 100 Without Airflow 90 Heatsink Temperature Rise Above 200 LFM Ambient (T = Ths - Ta) (C) 400 LFM 80 Power Natural 200 LFM 400 LFM (W) Conv. 70 0 0 0 0 60 1 15.97 4.39 3.27 50 2 31.26 8.90 6.45 3 45.86 13.39 9.63 40 4 58.55 17.73 13.18 30 5 70.33 21.93 16.39 20 6 80.76 26.48 19.66 7 90.04 30.88 23.26 10 8 97.89 35.46 26.64 0 9 104.05 40.56 30.58 01 23 45 6789 10 Dissipated Power (W) 10 112.16 45.35 33.51 Ths: hot spot temperature measured on the heatsink Ta: ambient temperature cuidevices.com Mounting Surface Temperature Rise Above Ambient (C)Additional Resources: Product Page 3D Model CUI Devices SERIES: HSE-BX-035H-02 DESCRIPTION: HEAT SINK date 02/11/2020 page 2 of 5 PERFORMANCE CURVES (CONTINUED) HSE-B20381-035H-02 100 Without Airflow 90 200 LFM Heatsink Temperature Rise Above 400 LFM 80 Ambient (T = Ths - Ta) (C) Power Natural 70 200 LFM 400 LFM (W) Conv. 60 0 0 0 0 1 13.97 3.32 2.14 50 2 26.02 7.06 5.29 40 3 36.45 10.74 8.06 30 4 47.83 14.35 11.12 5 56.91 18.07 13.94 20 6 66.68 21.87 16.57 10 7 76.12 25.59 19.23 0 8 83.63 29.34 21.97 012 34 5 6789 10 Dissipated Power (W) 9 90.62 33.16 24.05 10 99.30 36.38 26.25 Ths: hot spot temperature measured on the heatsink Ta: ambient temperature HSE-B20508-035H-01 100 Without Airflow Heatsink Temperature Rise Above 90 200 LFM Ambient (T = Ths - Ta) (C) 400 LFM 80 Power Natural 200 LFM 400 LFM (W) Conv. 70 0 0 0 0 60 1 13.03 4.76 3.21 50 2 23.71 9.71 6.44 40 3 33.48 14.54 9.72 30 4 42.45 19.34 12.99 20 5 51.22 24.34 16.17 10 6 59.26 29.08 19.43 7 66.97 33.72 22.66 0 01 23 455867 910 Heat Dissipated (W) 8 73.76 38.43 25.87 9 80.91 43.29 29.05 10 86.41 48.07 32.37 Ths: hot spot temperature measured on the heatsink Ta: ambient temperature cuidevices.com Mounting Surface Temperature Mounting Surface Temperature Rise Above Ambient (C) Rise Above Ambient (C)