HSE-B20254-040H CUI Devices

Additional Resources: Product Page 3D Model date 02/11/2020 page 1 of 4 SERIES: HSE-BX-040H DESCRIPTION: HEAT SINK FEATURES TO-220 package placement pins for secure PCB attachment round hole for component attachment multiple available cut lengths 1 thermal resistance power MODEL 1 dissipation length 75C T, 1 W, 1 W, 1 W, 75C T, nat conv nat conv 200 LFM 400 LFM nat conv (mm) (C/W) (C/W) (C/W) (C/W) (W) HSE-B20254-040H 25.4 13.16 16.13 7.74 5.77 5.70 HSE-B20381-040H 38.1 11.54 12.28 3.62 2.88 6.50 Note: 1. See performance curves for full thermal resistance details. 2. Custom cut to length options available. Thermal data not available on custom lengths. PERFORMANCE CURVES HSE-B20254-040H 100 Without Airflow Heatsink Temperature Rise Above 90 200 LFM Ambient (T = Ths - Ta) (C) 400 LFM 80 Power Natural 200 LFM 400 LFM (W) Conv. 70 0 0 0 0 60 1 16.13 7.74 5.77 50 2 29.25 15.62 11.53 40 3 42.80 23.81 17.04 30 4 55.72 31.68 22.66 20 5 67.84 39.53 28.21 10 6 78.06 47.35 33.83 7 88.34 54.42 39.65 0 01 23 45 67 89 10 8 97.77 62.21 45.28 Dissipated Power (W) 9 107.55 69.81 50.42 10 117.33 77.16 56.11 Ths: hot spot temperature measured on the heatsink Ta: ambient temperature cuidevices.com Mounting Surface Temperature Rise Above Ambient (C)Additional Resources: Product Page 3D Model CUI Devices SERIES: HSE-BX-040H DESCRIPTION: HEAT SINK date 02/11/2020 page 2 of 4 PERFORMANCE CURVES (CONTINUED) HSE-B20381-040H 100 Without Airflow Heatsink Temperature Rise Above 90 200 LFM Ambient (T = Ths - Ta) (C) 400 LFM 80 Power Natural 200 LFM 400 LFM (W) Conv. 70 0 0 0 0 60 1 12.28 3.62 2.88 2 25.96 7.21 5.70 50 3 37.80 11.15 8.98 40 4 49.04 14.86 11.55 30 5 59.64 18.82 13.90 6 70.27 22.54 16.43 20 7 79.30 26.31 19.41 10 8 89.57 30.28 21.97 0 9 98.10 34.00 24.72 012 34 5 6789 10 10 106.51 38.10 27.50 Dissipated Power (W) Ths: hot spot temperature measured on the heatsink Ta: ambient temperature cuidevices.com Mounting Surface Temperature Rise Above Ambient (C)