HSE-B20254-056H CUI Devices

Additional Resources: Product Page 3D Model date 02/11/2020 page 1 of 4 SERIES: HSE-BX-056H DESCRIPTION: HEAT SINK FEATURES TO-220 package placement pins for secure PCB attachment round hole for component attchment multiple available cut lengths 1 thermal resistance power MODEL 1 dissipation length 75C T, 1 W, 1 W, 1 W, 75C T, nat conv nat conv 200 LFM 400 LFM nat conv (mm) (C/W) (C/W) (C/W) (C/W) (W) HSE-B20254-056H 25.4 13.64 17.13 8.36 6.41 5.50 HSE-B20381-056H 38.1 11.19 15.00 3.53 2.56 6.70 Note: 1. See performance curves for full thermal resistance details. 2. Custom cut to length options available. Thermal data not available on custom lengths. PERFORMANCE CURVES HSE-B20254-056H 100 Without Airflow Heatsink Temperature Rise Above 90 200 LFM Ambient (T = Ths - Ta) (C) 400 LFM 80 Power Natural 200 LFM 400 LFM (W) Conv. 70 0 0 0 0 60 1 17.13 8.36 6.41 50 2 32.20 17.46 11.75 40 3 45.00 24.87 17.28 30 4 58.12 32.88 23.43 20 5 69.84 40.99 29.16 6 80.93 48.89 34.64 10 7 91.01 56.79 40.37 0 01 2345 67 89 10 Dissipated Power (W) 8 99.56 65.43 46.09 9 110.81 72.66 52.01 10 118.44 82.03 57.73 Ths: hot spot temperature measured on the heatsink Ta: ambient temperature cuidevices.com Mounting Surface Temperature Rise Above Ambient (C)Additional Resources: Product Page 3D Model CUI Devices SERIES: HSE-BX-056H DESCRIPTION: HEAT SINK date 02/11/2020 page 2 of 4 PERFORMANCE CURVES (CONTINUED) HSE-B20381-056H 100 Heatsink Temperature Rise Above Without Airflow Ambient (T = Ths - Ta) (C) 90 200 LFM Power Natural 400 LFM 200 LFM 400 LFM 80 (W) Conv. 0 0 0 0 70 1 15.00 3.53 2.56 60 2 27.32 7.15 5.23 50 3 38.89 10.82 7.90 4 49.63 14.38 10.72 40 5 59.72 17.90 13.32 30 6 69.31 21.80 16.03 20 7 77.53 25.42 18.80 8 87.53 28.89 21.65 10 9 95.75 32.68 24.48 0 012 34 5 6789 10 10 104.38 36.30 27.29 Dissipated Power (W) Ths: hot spot temperature measured on the heatsink Ta: ambient temperature cuidevices.com Mounting Surface Temperature Rise Above Ambient (C)