HSE-B20350-NP CUI Devices

Additional Resources: Product Page 3D Model date 02/12/2020 page 1 of 3 MODEL: HSE-B20350-NP DESCRIPTION: HEAT SINK FEATURES TO-220 package black anodized finish low profile 1 thermal resistance power MODEL 1 dissipation 75C T, 1 W, 1 W, 1 W, 75C T, nat conv nat conv 200 LFM 400 LFM nat conv (C/W) (C/W) (C/W) (C/W) (W) HSE-B20350-NP 12.10 15.42 2.91 2.13 6.20 Note: 1. See performance curves for full thermal resistance details. PERFORMANCE CURVES 100 Without Airflow 90 Heatsink Temperature Rise Above 200 LFM Ambient (T = Ths - Ta) (C) 400 LFM 80 Power Natural 200 LFM 400 LFM (W) Conv. 70 0 0 0 0 60 1 15.42 2.91 2.13 2 28.43 5.61 4.17 50 3 40.12 8.59 6.43 40 4 51.54 11.56 8.44 30 5 63.08 14.54 10.67 6 73.12 17.43 13.16 20 7 82.95 20.40 15.26 10 8 90.64 23.24 17.37 0 9 98.01 26.37 19.66 0123 45 6 789 10 10 101.81 29.12 21.88 Dissipated Power (W) Ths: hot spot temperature measured on the heatsink Ta: ambient temperature cuidevices.com Mounting Surface Temperature Rise Above Ambient (C)Additional Resources: Product Page 3D Model CUI Devices MODEL: HSE-B20350-NP DESCRIPTION: HEAT SINK date 02/12/2020 page 2 of 3 MECHANICAL DRAWING units: mm MATERIAL AL 6063-T5 tolerance: 0.5 mm FINISH black anodized WEIGHT 13.19 g cuidevices.com