X-On Electronics has gained recognition as a prominent supplier of HSE-B250-04H Heat Sinks across the USA, India, Europe, Australia, and various other global locations. HSE-B250-04H Heat Sinks are a product manufactured by CUI Devices. We provide cost-effective solutions for Heat Sinks, ensuring timely deliveries around the world.

HSE-B250-04H CUI Devices

HSE-B250-04H electronic component of CUI Devices
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See Product Specifications
Part No.HSE-B250-04H
Manufacturer: CUI Devices
Category: Heat Sinks
Description: HSE Series 25 x 35 x 25.4 mm 3.26°C/W Black Anodized PC Pin TO-220 Heatsink
Datasheet: HSE-B250-04H Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1: USD 1.1896 ea
Line Total: USD 1.19 
Availability - 843
Ship by Fri. 29 Nov to Tue. 03 Dec
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
630
Ship by Tue. 03 Dec to Mon. 09 Dec
MOQ : 25
Multiples : 25
25 : USD 1.4175
250 : USD 1.2246
750 : USD 1.1314
1500 : USD 1.05
3000 : USD 1.0395
5250 : USD 1.0132
7500 : USD 1.0028
10500 : USD 0.9923

843
Ship by Fri. 29 Nov to Tue. 03 Dec
MOQ : 1
Multiples : 1
1 : USD 1.1896
10 : USD 1.0995
25 : USD 1.0869
50 : USD 1.0661
100 : USD 1.0198
250 : USD 0.9702
750 : USD 0.8905

   
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RoHS - XON
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We are delighted to provide the HSE-B250-04H from our Heat Sinks category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the HSE-B250-04H and other electronic components in the Heat Sinks category and beyond.

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Additional Resources: Product Page 3D Model date 02/11/2020 page 1 of 5 SERIES: HSE-BX-04H-01 DESCRIPTION: HEAT SINK FEATURES TO-220 package placement pins for secure PCB attachment round hole for component attachment multiple available cut lengths 1 thermal resistance power MODEL 1 dissipation length 75C T, 1 W, 1 W, 1 W, 75C T, nat conv nat conv 200 LFM 400 LFM nat conv (mm) (C/W) (C/W) (C/W) (C/W) (W) HSE-B250-04H 25 9.38 13.60 3.26 2.25 8.00 HSE-B500-04H 50 6.15 8.05 2.88 2.12 12.20 HSE-B630-04H 63 5.21 9.37 2.31 1.86 14.40 Note: 1. See performance curves for full thermal resistance details. 2. Custom cut to length options available. Thermal data not available on custom lengths. PERFORMANCE CURVES HSE-B250-04H 100 Without Airflow Heatsink Temperature Rise Above 90 200 LFM Ambient (T = Ths - Ta) (C) 400 LFM 80 Power Natural 200 LFM 400 LFM (W) Conv. 70 0 0 0 0 60 1 13.60 3.26 2.25 2 24.62 6.61 4.65 50 3 34.26 10.05 7.18 40 4 43.45 13.46 9.67 30 5 51.69 16.85 12.11 6 60.18 20.16 14.49 20 7 68.13 23.72 17.06 10 8 75.33 27.06 19.37 0 9 82.77 30.36 21.85 01 23 45 6789 10 10 90.41 34.06 24.45 Dissipated Power (W) Ths: hot spot temperature measured on the heatsink Ta: ambient temperature cuidevices.com Mounting Surface Temperature Rise Above Ambient (C)Additional Resources: Product Page 3D Model CUI Devices SERIES: HSE-BX-04H-01 DESCRIPTION: HEAT SINK date 02/11/2020 page 2 of 5 PERFORMANCE CURVES (CONTINUED) HSE-B500-04H 100 Without Airflow Heatsink Temperature Rise Above 90 200 LFM Ambient (T = Ths - Ta) (C) 400 LFM Power Natural 80 200 LFM 400 LFM (W) Conv. 0 0 0 0 70 1 8.05 2.88 2.12 60 2 15.65 6.20 3.91 50 3 22.61 9.34 6.03 4 29.06 12.43 8.12 40 5 35.34 15.82 10.15 30 6 41.17 18.99 12.26 20 7 46.96 22.14 14.37 8 53.06 24.84 16.58 10 9 58.73 28.02 18.67 0 012 34 5 6 789 10 11 12 13 14 15 10 63.92 31.30 20.68 Dissipated Power (W) 11 69.02 34.30 22.85 12 74.20 37.50 25.06 13 78.99 40.75 27.25 14 83.83 43.67 29.22 15 88.40 46.82 31.27 Ths: hot spot temperature measured on the heatsink Ta: ambient temperature cuidevices.com Mounting Surface Temperature Rise Above Ambient (C)

Tariff Desc

7612.90.00 -Other Aluminium structures (excluding prefabricated buildings of heading no. 94.06) and parts of structures (for example, bridges and bridge-sections, towers, lattice masts, roofs, roofing frameworks, doors and windows and their frames and thresholds for doors, balustrades, pillars and columns); aluminium plates, rods, profiles, tubes and the like, prepared for use in structures:
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