HSE-B254-045H CUI Devices

Additional Resources: Product Page 3D Model date 02/11/2020 page 1 of 5 SERIES: HSE-BX-045H DESCRIPTION: HEAT SINK FEATURES TO-220 package placement pins for secure PCB attachment round hole for component attachment multiple available cut lengths 1 thermal resistance power MODEL 1 dissipation length 75C T, 1 W, 1 W, 1 W, 75C T, nat conv nat conv 200 LFM 400 LFM nat conv (mm) (C/W) (C/W) (C/W) (C/W) (W) HSE-B254-045H 25.4 11.72 16.12 3.86 2.52 6.40 HSE-B381-045H 38.1 7.58 8.52 2.63 1.82 9.90 HSE-B508-045H 50.8 8.06 10.52 4.38 2.89 9.30 HSE-B635-045H 63.5 6.41 7.99 3.53 2.49 11.70 Note: 1. See performance curves for full thermal resistance details. 2. Custom cut to length options available. Thermal data not available on custom lengths. PERFORMANCE CURVES HSE-B254-045H 100 Without Airflow Heatsink Temperature Rise Above 90 200 LFM Ambient (T = Ths - Ta) (C) 400 LFM 80 Power Natural 200 LFM 400 LFM (W) Conv. 70 0 0 0 0 60 1 16.12 3.86 2.52 2 29.41 8.30 5.68 50 3 40.00 12.22 9.31 40 4 51.44 16.39 12.14 30 5 61.45 20.66 15.34 6 72.61 24.92 18.41 20 7 80.92 28.68 20.86 10 8 90.03 33.22 23.73 0 9 96.81 37.23 26.92 01 23 45 6789 10 10 105.60 41.07 30.04 Dissipated Power (W) Ths: hot spot temperature measured on the heatsink Ta: ambient temperature cuidevices.com Mounting Surface Temperature Rise Above Ambient (C)Additional Resources: Product Page 3D Model CUI Devices SERIES: HSE-BX-045H DESCRIPTION: HEAT SINK date 02/11/2020 page 2 of 5 PERFORMANCE CURVES (CONTINUED) HSE-B381-045H 100 Without Airflow Heatsink Temperature Rise Above 90 200 LFM Ambient (T = Ths - Ta) (C) 400 LFM 80 Power Natural 200 LFM 400 LFM (W) Conv. 70 0 0 0 0 60 1 8.52 2.63 1.82 2 18.47 5.51 3.87 50 3 26.83 8.39 5.96 40 4 33.30 11.14 7.95 30 5 39.77 13.92 10.01 6 46.62 16.71 12.03 20 7 53.59 19.45 13.95 10 8 60.45 22.41 16.05 0 9 68.22 25.10 17.98 0 123 45 6789 10 10 75.13 28.11 20.06 Dissipated Power (W) Ths: hot spot temperature measured on the heatsink Ta: ambient temperature HSE-B508-045H 100 Without Airflow Heatsink Temperature Rise Above 90 200 LFM Ambient (T = Ths - Ta) (C) 400 LFM 80 Power Natural 200 LFM 400 LFM (W) Conv. 70 0 0 0 0 60 1 10.52 4.38 2.89 2 19.69 8.39 5.86 50 3 28.40 12.74 8.86 40 4 37.10 16.93 12.02 30 5 44.72 21.55 14.92 20 6 52.72 25.52 18.01 7 60.03 30.14 20.94 10 8 66.70 34.56 24.08 0 9 73.41 38.67 26.72 0 123 45 6789 10 Dissipated Power (W) 10 79.99 42.96 29.99 Ths: hot spot temperature measured on the heatsink Ta: ambient temperature cuidevices.com Mounting Surface Temperature Mounting Surface Temperature Rise Above Ambient (C) Rise Above Ambient (C)