X-On Electronics has gained recognition as a prominent supplier of HSS02-B20-P318 Heat Sinks across the USA, India, Europe, Australia, and various other global locations. HSS02-B20-P318 Heat Sinks are a product manufactured by CUI Devices. We provide cost-effective solutions for Heat Sinks, ensuring timely deliveries around the world.

HSS02-B20-P318 CUI Devices

HSS02-B20-P318 electronic component of CUI Devices
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See Product Specifications
Part No.HSS02-B20-P318
Manufacturer: CUI Devices
Category: Heat Sinks
Description: Heat Sinks heat sink, stamping, TO-220, 23.62 x 48.
Datasheet: HSS02-B20-P318 Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1: USD 0.8812 ea
Line Total: USD 0.88 
Availability - 1589
Ship by Thu. 28 Nov to Mon. 02 Dec
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
1589
Ship by Thu. 28 Nov to Mon. 02 Dec
MOQ : 1
Multiples : 1
1 : USD 0.8812
10 : USD 0.8697
25 : USD 0.8697
50 : USD 0.8547
100 : USD 0.8362
5280 : USD 0.8351

   
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We are delighted to provide the HSS02-B20-P318 from our Heat Sinks category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the HSS02-B20-P318 and other electronic components in the Heat Sinks category and beyond.

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Additional Resources: Product Page 3D Model date 06/25/2021 page 1 of 3 MODEL: HSS02-B20-P318 DESCRIPTION: HEAT SINK FEATURES TO-220 package solder pin aluminum alloy black anodized finish 1 thermal resistance power MODEL 1 dissipation 75C T, 1 W, 1 W, 1 W, 75C T, nat conv nat conv 200 LFM 400 LFM nat conv (C/W) (C/W) (C/W) (C/W) (W) HSS02-B20-P318 10.90 14.1 4.8 3.7 6.88 Note: 1. See performance curves for full thermal resistance details. PERFORMANCE CURVES 120 Without Airow 100 Heatsink Temperature Rise Above 200 LFM Ambient (T = Ths - Ta) (C) 80 400 LFM Power Natural 200 LFM 400 LFM (W) Conv. 0 0 0 0 60 1 14.1 4.8 3.7 2 25.8 9.6 7.3 40 3 37.3 14.4 11.0 4 47.8 19.3 14.6 20 5 57.6 23.9 18.2 6 67.1 28.7 21.8 0 012345678 91011 7 76.3 33.4 25.2 8 85.4 38.2 28.9 Heat Dissipated (W) 9 94.5 43.2 32.6 10 103.2 48.0 36.2 Ths: hot spot temperature measured on the heatsink Ta: ambient temperature cuidevices.com Mounting Surface Temperature Rise Above Ambient (C)Additional Resources: Product Page 3D Model CUI Devices MODEL: HSS02-B20-P318 DESCRIPTION: HEAT SINK date 06/25/2021 page 2 of 3 MECHANICAL DRAWING units: mm MATERIAL AL 1050 tolerance: 0.3 mm FINISH black anodized THICKNESS 1.2 mm PIN MATERIAL phosphor bronze PIN PLATING 2~3 m tin WEIGHT 9.1 g cuidevices.com

Tariff Desc

7612.90.00 -Other Aluminium structures (excluding prefabricated buildings of heading no. 94.06) and parts of structures (for example, bridges and bridge-sections, towers, lattice masts, roofs, roofing frameworks, doors and windows and their frames and thresholds for doors, balustrades, pillars and columns); aluminium plates, rods, profiles, tubes and the like, prepared for use in structures:
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